Senior HBM Architecture & Circuit Design Engineer

Micron Technology, Inc.; Richardson (TX); On-site; USD 150,000 - 210,000; Full time

Benefits offered by this job

Medical, dental & vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Richardson, Texas, seeks an Principal HBM Architecture & Circuit Design Engineer to own next‑generation HBM core‑die architecture and critical DRAM circuit design.

You will drive architecture definition, feasibility studies, and ARD development across 3D‑stacked HBM products, enabling AI‑enabled solutions with improved bandwidth, power efficiency, and reliability. The role collaborates with multiple teams to hand off silicon bring‑up, characterization, and

Qualifications

• Proven experience in DRAM architecture and circuit design.
• Hands-on SPICE-based circuit simulation experience.
• Ability to evaluate performance, power, area, and reliability trade-offs.

Responsibilities

• Own HBM core-die architecture, bank organization, datapath, and reliability features.
• Drive DRAM circuit design and timing closure for row/column paths.
• Develop architecture trade-offs for bandwidth, power, area, thermal, and reliability.
• Define and validate refresh, row-hammer mitigation, data-retention and power-efficient operation schemes.
• Lead architecture feasibility studies using transistor-level simulations and physical analysis.
• Collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams.

Skills

DRAM architecture

Circuit design

SPICE simulation

Cross-functional collaboration

Performance trade-offs

Tools

HSPICE

Spectre

PrimeSim

FineSim

Job description

Micron Technology, Inc. in Richardson, Texas, seeks an Principal HBM Architecture & Circuit Design Engineer to own next‑generation HBM core‑die architecture and critical DRAM circuit design.

You will drive architecture definition, feasibility studies, and ARD development across 3D‑stacked HBM products, enabling AI‑enabled solutions with improved bandwidth, power efficiency, and reliability. The role collaborates with multiple teams to hand off silicon bring‑up, characterization, and