HBM Core-Die Architect & Circuit Design Lead

Micron Technology, Inc.; Richardson (TX); Sur place; USD 140 000 - 210 000; Plein temps

Résumé du poste

Micron Technology, Inc. seeks a dedicated HBM Core-Die Architecture & Circuit Design Engineer to own core-die architecture and critical DRAM circuit design impacting bandwidth, power, and reliability.

You will drive architecture definition and ARD development for advanced 3D-stacked HBM products and collaborate across multiple teams to ensure successful silicon bring-up and verification. The role requires hands-on circuit design expertise, SPICE-based simulation proficiency, and a track record

Qualifications

• Proven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent).
• Strong understanding of DRAM array architecture, row/column paths, sensing, datapath, refresh, and reliability mechanisms.
• Hands-on experience with SPICE-based circuit simulation tools such as HSPICE, Spectre, FineSim, or PrimeSim.
• Ability to evaluate performance, power, area, thermal, and reliability trade-offs.
• Experience driving architecture decisions and cross-functional technical execution.

Responsabilités

• Own HBM core‑die architecture including Bank/Bank‑Group organization, array partitioning, datapath, refresh, and reliability features
• Drive critical DRAM circuit design and timing closure for row, column, sensing, and datapath paths
• Develop and optimize architecture solutions for bandwidth, power, area, thermal, and reliability trade‑offs
• Define and validate refresh, row‑hammer mitigation, data‑retention, and power‑efficient operation schemes
• Lead architecture feasibility studies using transistor‑level simulation and physical implementation analysis
• Develop HBM Architecture Reference Designs (ARD), including golden schematics, timing budgets, and verification methodology
• Collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams to drive end‑to‑end design execution
• Support silicon bring‑up, characterization, failure analysis, and architecture‑to‑design handoff

Connaissances

DRAM architecture experience

Circuit design

Problem solving

Communication skills

Outils

SPICE simulators

Description du poste

Micron Technology, Inc. seeks a dedicated HBM Core-Die Architecture & Circuit Design Engineer to own core-die architecture and critical DRAM circuit design impacting bandwidth, power, and reliability.

You will drive architecture definition and ARD development for advanced 3D-stacked HBM products and collaborate across multiple teams to ensure successful silicon bring-up and verification. The role requires hands-on circuit design expertise, SPICE-based simulation proficiency, and a track record