HBM Core-Die Architect & Circuit Design Engineer

Micron Technology, Inc.; Richardson (TX); On-site; USD 150,000 - 210,000; Full time

Benefits offered by this job

Medical-Dental-Vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Richardson, TX is seeking an MTS HBM Architecture & Circuit Design Engineer to lead next-generation HBM core-die architecture and critical DRAM circuit design.

You will drive architecture definition, circuit feasibility, and Architecture Reference Design (ARD) development across advanced 3D-stacked HBM products. Role involves collaboration with multiple teams to drive end-to-end design execution, silicon bring-up, characterization, and handoff.

Qualifications

• Proven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent).
• Hands-on experience with SPICE-based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent).
• Ability to evaluate performance, power, area, thermal, and reliability trade-offs.

Responsibilities

• Own HBM core-die architecture including Bank/Bank-Group organization and datapath paths.
• Drive circuit design and timing closure for row/column, sensing and datapath paths.
• Develop and optimize architecture solutions for bandwidth, power, area, and reliability trade-offs.
• Lead architecture feasibility studies using transistor-level simulation and physical implementation analysis.
• Collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams.

Skills

DRAM architecture

Circuit design

SPICE simulations

Cross-functional collaboration

Problem solving

Communication

Tools

HSPICE

Spectre

FineSim

PrimeSim

Job description

Micron Technology, Inc. in Richardson, TX is seeking an MTS HBM Architecture & Circuit Design Engineer to lead next-generation HBM core-die architecture and critical DRAM circuit design.

You will drive architecture definition, circuit feasibility, and Architecture Reference Design (ARD) development across advanced 3D-stacked HBM products. Role involves collaboration with multiple teams to drive end-to-end design execution, silicon bring-up, characterization, and handoff.