HBM Architecture & Circuit Design Engineer — Drive Next‑Gen Memory

Micron Technology, Inc.; Boise (ID); On-site; USD 140,000 - 190,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking an HBM Core-Die Architecture & Circuit Design Engineer to own next-generation DRAM core-die architecture and critical circuit design, impacting bandwidth, power, and reliability, with ARD development and silicon bring-up responsibilities.

You will collaborate across arrays, datapath, ECC, TSV, PDN, and layout teams, drive feasibility studies, and support hardware in AI-enabled solutions, requiring strong communication and problem-solving skills.

Qualifications

• Proven experience in DRAM architecture and circuit design.
• Strong understanding of DRAM array architecture, row/column paths, sensing, datapath, refresh, and reliability mechanisms.
• Hands-on experience with SPICE-based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent).
• Ability to evaluate performance, power, area, thermal, and reliability trade-offs.
• Experience driving architecture decisions and cross-functional technical execution.
• Strong problem-solving and communication skills.

Responsibilities

• Own HBM core-die architecture including Bank/Bank-Group organization, array partitioning, datapath, refresh, and reliability features
• Drive critical DRAM circuit design and timing closure for row, column, sensing, and datapath paths
• Develop and optimize architecture solutions for bandwidth, power, area, thermal, and reliability trade-offs
• Define and validate refresh, row-hammer mitigation, data-retention, and power-efficient operation schemes
• Lead architecture feasibility studies using transistor-level simulation and physical implementation analysis
• Develop HBM Architecture Reference Designs (ARD), including golden schematics, timing budgets, and verification methodology
• Collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams to drive end-to-end design execution
• Support silicon bring-up, characterization, failure analysis, and architecture-to-design handoff

Skills

DRAM architecture

Circuit design

Cross-functional collaboration

Problem-solving

Communication skills

Tools

SPICE-based simulators

HSPICE

Spectre

FineSim

PrimeSim

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking an HBM Core-Die Architecture & Circuit Design Engineer to own next-generation DRAM core-die architecture and critical circuit design, impacting bandwidth, power, and reliability, with ARD development and silicon bring-up responsibilities.

You will collaborate across arrays, datapath, ECC, TSV, PDN, and layout teams, drive feasibility studies, and support hardware in AI-enabled solutions, requiring strong communication and problem-solving skills.