HBM Core Architect & Circuit Design Engineer

Micron Technology, Inc.; Richardson (TX); On-site; USD 150,000 - 308,000; Full time

Job summary

Micron Technology, Inc. in the United States is seeking a Principal HBM Architecture & Circuit Design Engineer to own next‑generation HBM core‑die architecture and critical DRAM circuit design that impact bandwidth, power, area, and reliability across advanced 3D‑stacked products.

You will drive architecture definition, circuit feasibility, and ARD development, collaborate across multiple teams, support silicon bring‑up and characterization, and help deliver AI‑enabled solutions with robust

Qualifications

• Proven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent)
• Strong understanding of DRAM array architecture, row/column paths, sensing, datapath, refresh, and reliability mechanisms
• Hands‑on experience with SPICE‑based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent)
• Ability to evaluate performance, power, area, thermal, and reliability trade‑offs
• Experience driving architecture decisions and cross‑functional technical execution
• Strong problem‑solving and communication skills

Responsibilities

• Own HBM core‑die architecture including Bank/Bank‑Group organization, array partitioning, datapath, refresh, and reliability features
• Drive critical DRAM circuit design and timing closure for row, column, sensing, and datapath paths
• Develop and optimize architecture solutions for bandwidth, power, area, thermal, and reliability trade‑offs
• Define and validate refresh, row‑hammer mitigation, data‑retention, and power‑efficient operation schemes
• Lead architecture feasibility studies using transistor‑level simulation and physical implementation analysis
• Develop HBM Architecture Reference Designs (ARD), including golden schematics, timing budgets, and verification methodology
• Collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams to drive end‑to‑end design execution
• Support silicon bring‑up, characterization, failure analysis, and architecture‑to‑design handoff

Skills

DRAM architecture

Circuit design

SPICE simulations

Cross-functional work

Problem solving

Communication skills

Tools

HSPICE

Spectre

FineSim

PrimeSim

Job description

Micron Technology, Inc. in the United States is seeking a Principal HBM Architecture & Circuit Design Engineer to own next‑generation HBM core‑die architecture and critical DRAM circuit design that impact bandwidth, power, area, and reliability across advanced 3D‑stacked products.

You will drive architecture definition, circuit feasibility, and ARD development, collaborate across multiple teams, support silicon bring‑up and characterization, and help deliver AI‑enabled solutions with robust