HBM Core-Die Architect & DRAM Circuit Designer

Micron Technology, Inc.; Richardson (TX); Presencial; USD 140.000 - 210.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Descripción de la vacante

Micron Technology, Inc. is seeking an HBM Core-Die Architecture & Circuit Design Engineer to own next-generation HBM core-die architecture and critical DRAM circuit design that impact bandwidth, power, and reliability.

You will drive architecture definition and ARD development across advanced 3D-stacked HBM products, enabling AI-enabled solutions and efficient data processing. As part of a world-leading semiconductor team, you will collaborate with multiple engineering groups to deliver

Formación

• Proven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent).
• Strong understanding of DRAM array architecture, row/column paths, sensing, datapath, refresh, and reliability mechanisms.
• Hands-on experience with SPICE-based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent).
• Ability to evaluate performance, power, area, thermal, and reliability trade-offs.
• Experience driving architecture decisions and cross-functional technical execution.
• Strong problem-solving and communication skills.

Responsabilidades

• Own HBM core-die architecture including Bank/Bank-Group organization, array partitioning, datapath, refresh, and reliability features.
• Drive critical DRAM circuit design and timing closure for row, column, sensing, and datapath paths.
• Develop and optimize architecture solutions for bandwidth, power, area, thermal, and reliability trade-offs.
• Define and validate refresh, row-hammer mitigation, data-retention, and power-efficient operation schemes.
• Lead architecture feasibility studies using transistor-level simulation and physical implementation analysis.
• Develop HBM Architecture Reference Designs (ARD), including golden schematics, timing budgets, and verification methodology.
• Collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams to drive end-to-end design execution.
• Support silicon bring-up, characterization, failure analysis, and architecture-to-design handoff.

Conocimientos

DRAM architecture

Reliability mechanisms

SPICE-based circuit simulation

Performance/power/area trade-offs

Cross-functional execution

Problem-solving & communication

Herramientas

SPICE-based circuit simulation tools

Descripción del empleo

Micron Technology, Inc. is seeking an HBM Core-Die Architecture & Circuit Design Engineer to own next-generation HBM core-die architecture and critical DRAM circuit design that impact bandwidth, power, and reliability.

You will drive architecture definition and ARD development across advanced 3D-stacked HBM products, enabling AI-enabled solutions and efficient data processing. As part of a world-leading semiconductor team, you will collaborate with multiple engineering groups to deliver