HBM Core-Die Architect & DRAM Circuit Designer

Micron Technology, Inc.; Richardson (TX); On-site; USD 140,000 - 210,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking an HBM Core-Die Architecture & Circuit Design Engineer to own next-generation HBM core-die architecture and critical DRAM circuit design that impact bandwidth, power, and reliability.

You will drive architecture definition and ARD development across advanced 3D-stacked HBM products, enabling AI-enabled solutions and efficient data processing. As part of a world-leading semiconductor team, you will collaborate with multiple engineering groups to deliver

Qualifications

• Proven experience in DRAM architecture and circuit design (HBM, DDR, LPDDR, GDDR, or equivalent).
• Strong understanding of DRAM array architecture, row/column paths, sensing, datapath, refresh, and reliability mechanisms.
• Hands-on experience with SPICE-based circuit simulation tools (HSPICE, Spectre, FineSim, PrimeSim, or equivalent).
• Ability to evaluate performance, power, area, thermal, and reliability trade-offs.
• Experience driving architecture decisions and cross-functional technical execution.
• Strong problem-solving and communication skills.

Responsibilities

• Own HBM core-die architecture including Bank/Bank-Group organization, array partitioning, datapath, refresh, and reliability features.
• Drive critical DRAM circuit design and timing closure for row, column, sensing, and datapath paths.
• Develop and optimize architecture solutions for bandwidth, power, area, thermal, and reliability trade-offs.
• Define and validate refresh, row-hammer mitigation, data-retention, and power-efficient operation schemes.
• Lead architecture feasibility studies using transistor-level simulation and physical implementation analysis.
• Develop HBM Architecture Reference Designs (ARD), including golden schematics, timing budgets, and verification methodology.
• Collaborate with Array, Datapath, ECC, TSV, PDN, Layout, Verification, and DFT teams to drive end-to-end design execution.
• Support silicon bring-up, characterization, failure analysis, and architecture-to-design handoff.

Skills

DRAM architecture

Reliability mechanisms

SPICE-based circuit simulation

Performance/power/area trade-offs

Cross-functional execution

Problem-solving & communication

Tools

SPICE-based circuit simulation tools

Job description

Micron Technology, Inc. is seeking an HBM Core-Die Architecture & Circuit Design Engineer to own next-generation HBM core-die architecture and critical DRAM circuit design that impact bandwidth, power, and reliability.

You will drive architecture definition and ARD development across advanced 3D-stacked HBM products, enabling AI-enabled solutions and efficient data processing. As part of a world-leading semiconductor team, you will collaborate with multiple engineering groups to deliver