Senior HBM Architect—IC Design & Innovation

Micron Technology, Inc.; Boise (ID); Presencial; USD 150.000 - 240.000; Jornada completa

Descripción de la vacante

Micron Technology, Inc. in Boise, Idaho, is seeking a Principal HBM Architecture & Circuit Design Engineer to drive advanced memory solutions.

You will lead architecture exploration for high-bandwidth memory (HBM), mentor engineers, and collaborate with product teams to deliver innovative SRAM/DRAM integration and interface concepts. The role requires deep expertise in 3D-stacked memory, analog/mixed-signal design, signal integrity, and verification methodologies.

Descripción del empleo

Micron Technology, Inc. in Boise, Idaho, is seeking a Principal HBM Architecture & Circuit Design Engineer to drive advanced memory solutions.

You will lead architecture exploration for high-bandwidth memory (HBM), mentor engineers, and collaborate with product teams to deliver innovative SRAM/DRAM integration and interface concepts. The role requires deep expertise in 3D-stacked memory, analog/mixed-signal design, signal integrity, and verification methodologies.