Senior Customer Integration Engineer — HBM Systems (Boise)

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 120,000 - 170,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off

Paid holidays

Paid family leave

Job summary

Micron Technology is seeking a Principal Customer Integration Engineer in Boise, Idaho, to lead technical engagement across product development, system architecture, and testing for high-bandwidth memory (HBM) products. The role involves working with multi-functional teams to ensure successful customer integration and qualification of advanced memory solutions.

The candidate will apply deep technical knowledge, participate in reviews, and drive failure analysis and yield improvements while

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related technical field.
• Hands-on experience in product development, systems build, front-end/back-end process, PFA, qualification, or test.
• Collaborate with Customer Integration Lead and Technical Leader during technical discussions with customers.

Responsibilities

• Apply deep technical knowledge across product engineering, system engineering, build, front-end/back-end process, PFA, qualification, or test.
• Support integration of customer requirements into internal design and manufacturing processes.
• Participate in technical reviews, debug sessions, and failure analysis activities.
• Work with internal teams to resolve technical challenges across build, product engineering, and manufacturing.
• Assist in yield improvement and qualification efforts tied to customer programs.

Skills

Product development

Systems engineering

Failure analysis

Cross-functional collaboration

Education

Bachelor’s or Master’s degree in Electrical/Mechanical/Materials Science (or related field)

Job description

Micron Technology is seeking a Principal Customer Integration Engineer in Boise, Idaho, to lead technical engagement across product development, system architecture, and testing for high-bandwidth memory (HBM) products. The role involves working with multi-functional teams to ensure successful customer integration and qualification of advanced memory solutions.

The candidate will apply deep technical knowledge, participate in reviews, and drive failure analysis and yield improvements while