Mixed-Signal Design Architect for 3D HBM Memory

1000 Micron Technology, Inc.; Folsom (CA); On-site; USD 146,000 - 297,000; Full time

Job summary

Micron Technology, a world leader in memory and storage, seeks a Senior Engineer/Principal Engineer/MT&S Design Architect for the Next‑generation HBM Architecture Team in the US. You will design, simulate, analyze and optimize 3D‑stacked high‑performance memories for AI workloads, collaborating with architecture and design peers.

Responsibilities include defining circuit implementations, technology requirements, thermal improvements, power delivery, and interfaces, with emphasis on

Qualifications

• Minimum qualifications: analog and/or mixed-signal design experience with simulation and floorplanning.
• Experience with transistor-level simulation (e.g., FineSim, HSPICE) including corner analysis.
• Ability to analyze architecture tradeoffs to develop specifications.
• Experience with power delivery analysis, tradeoffs, constraints, and challenges.

Responsibilities

• Design, optimize, and simulate critical analog and/or mixed-signal circuits.
• Architect and design power delivery for high-performance, stacked memories.
• Analyze, specify, and prototype on-/off-chip interfaces.
• Perform timing, area, power, and complexity analysis for high-performance, low-power circuits.
• Define architectures for improved thermal management.
• Conduct pathfinding activities for future-generation stacked-memory products.
• Compose and maintain clear architecture documentation.

Job description

Micron Technology, a world leader in memory and storage, seeks a Senior Engineer/Principal Engineer/MT&S Design Architect for the Next‑generation HBM Architecture Team in the US. You will design, simulate, analyze and optimize 3D‑stacked high‑performance memories for AI workloads, collaborating with architecture and design peers.

Responsibilities include defining circuit implementations, technology requirements, thermal improvements, power delivery, and interfaces, with emphasis on