Senior FCBGA Packaging Engineer for SoC NPI to Volume

Apple Inc.; Austin (TX); On-site; USD 100,000 - 130,000; Full time

Job summary

A leading technology company in Austin, Texas is seeking an IC Packaging Assembly Engineer. The role involves owning the FCBGA assembly process from development through manufacturing, leading technology development, and ensuring high-quality standards. Candidates should have a BS with 10+ years of experience in the field, with a preference for advanced degrees. The position offers competitive challenges in a dynamic environment focused on cutting-edge technologies.

Qualifications

• BS and 10+ years of experience in relevant industry experience or equivalent.
• M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or related field is desired.
• 5+ years of extensive experience in Semiconductor Packaging field.

Responsibilities

• Define and optimize end-to-end FCBGA assembly process flow.
• Develop and maintain process documentation including process specs and work instructions.
• Plan and execute DOEs to improve yield, quality, and cost.

Skills

Materials characterization

Engineering problem solving

Communication

Process documentation

Education

BS in relevant field

M.S. or PhD in relevant field

Tools

APD

Virtuoso

Job description

A leading technology company in Austin, Texas is seeking an IC Packaging Assembly Engineer. The role involves owning the FCBGA assembly process from development through manufacturing, leading technology development, and ensuring high-quality standards. Candidates should have a BS with 10+ years of experience in the field, with a preference for advanced degrees. The position offers competitive challenges in a dynamic environment focused on cutting-edge technologies.