Director, Chiplet & FCBGA Integration

Amkor Technology, Inc.; Tempe (AZ); Hybrid; USD 130,000 - 160,000; Full time

Job summary

A leading semiconductor solutions provider is seeking a Director, Chiplets and FCBGA, for their Tempe, AZ office. This role involves program management for advanced chiplet-based IC packages and coordinating with Tier 1 customers. Candidates should possess a Bachelor's in Engineering and over 10 years of semiconductor packaging experience. A hybrid schedule is available, and candidates must reside near the office or be willing to relocate. Strong communication and team management skills are essential.

Qualifications

• 10+ years of experience in semiconductor package development required.
• Working knowledge of mechanical stress/strain and IC package warpage required.
• Experience in high-density fan-out (HDFO) packaging preferred.

Responsibilities

• Drive and coordinate development activities with customers.
• Lead Tier 1 customer interface meetings during project development.
• Manage a cross-functional team including R&D and design teams.

Skills

IC package design knowledge

Excellent communication skills

Team management

Knowledge of IC packaging materials

Education

Bachelor's Degree in Engineering

Master's Degree (preferred)

Job description

A leading semiconductor solutions provider is seeking a Director, Chiplets and FCBGA, for their Tempe, AZ office. This role involves program management for advanced chiplet-based IC packages and coordinating with Tier 1 customers. Candidates should possess a Bachelor's in Engineering and over 10 years of semiconductor packaging experience. A hybrid schedule is available, and candidates must reside near the office or be willing to relocate. Strong communication and team management skills are essential.