Principal IC Packaging Engineer 2.5D/3D for Data Center AI
Qualcomm
San Diego (CA)
On-site
USD 201,600 - 302,400
Full time
14 days+
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Benefits offered by this job
Competitive salary
Annual discretionary bonus
RSU grants
Comprehensive benefits package
Job summary
A leading tech company is seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit packaging technologies. This position demands extensive experience in packaging methods and the ability to manage multi-disciplinary teams. Applicants should possess at least 17 years of hands-on experience, preferably in 2.5D/3D packaging. The position offers competitive compensation ranging from $201,600 to $302,400, along with opportunities for bonuses and annual RSU grants.
Qualifications
17+ years of hands-on experience in packaging technology development, particularly in 2.5D/3D.
Comprehensive understanding of semiconductor packaging trends and requirements.
Capability to lead multi-functional teams and resolve complex technical challenges.
Responsibilities
Lead the development of advanced packaging technologies.
Manage product introductions and transition to high-volume manufacturing.
Oversee collaboration with foundries and OSATs.
Skills
Leadership
Technical problem-solving
Communication skills
Project management
Collaboration
Education
M.S. or Ph.D. in Mechanical, Electrical, or Materials Engineering
Bachelor's degree in relevant field
Tools
Packaging technologies
Reliability standards
Failure analysis techniques
Job description
A leading tech company is seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit packaging technologies. This position demands extensive experience in packaging methods and the ability to manage multi-disciplinary teams. Applicants should possess at least 17 years of hands-on experience, preferably in 2.5D/3D packaging. The position offers competitive compensation ranging from $201,600 to $302,400, along with opportunities for bonuses and annual RSU grants.