IC Packaging & Integration Lead — Drive Innovative Solutions

Apple Inc.; Austin (TX); On-site; USD 130,000 - 160,000; Full time

Job summary

A leading technology company based in Austin, Texas, is seeking an IC Packaging Engineering Lead to drive innovative packaging solutions and collaborate with cross-functional teams. The role requires a BS degree and 20+ years of relevant industry experience, with strong skills in semiconductor packaging design and managerial capabilities. The ideal candidate will excel in problem-solving and communication, capable of working independently and managing teams effectively. This position offers the opportunity to work on groundbreaking technologies that influence product development.

Qualifications

• Experience in Semiconductor Packaging Design, Process & Technology Development.
• Excellent understanding of cross‑functional packaging areas.
• Knowledge of advanced packaging technologies.

Responsibilities

• Lead package co‑design efforts with multiple engineering teams.
• Drive package technology development impacting performance and cost.
• Create packaging design documentation and assessments.

Skills

Semiconductor Packaging Design

Process & Technology Development

Managerial skills

Excellent communication skills

Problem solving with strong physics

Education

BS and 20+ years of relevant industry experience

Tools

Cadence APD/Allegro

Job description

A leading technology company based in Austin, Texas, is seeking an IC Packaging Engineering Lead to drive innovative packaging solutions and collaborate with cross-functional teams. The role requires a BS degree and 20+ years of relevant industry experience, with strong skills in semiconductor packaging design and managerial capabilities. The ideal candidate will excel in problem-solving and communication, capable of working independently and managing teams effectively. This position offers the opportunity to work on groundbreaking technologies that influence product development.