A technology startup in San Jose is seeking an experienced IC Package Mechanical FEA Engineer to develop high-performance packaging solutions for advanced ASICs. The ideal candidate will possess a Bachelor's in Mechanical Engineering or related field and have extensive experience with FEA tools and advanced packaging technologies. Responsibilities include performing simulations, collaborating with various teams, and supporting technology road-mapping. This role offers a unique opportunity to impact the future of AI-focused technologies.
Qualifications
Bachelor's in Mechanical Engineering (or related field) with 12+ years FEA experience.
Deep expertise in advanced packaging technologies like flip-chip, 2.5D/3D integration.
Ability to interpret and correlate complex simulation results.
Responsibilities
Perform FEA simulations to evaluate reliability risks across advanced package architectures.
Collaborate with cross-functional teams to ensure robust package architectures.
Lead DOE studies to identify key reliability and performance drivers.
Skills
FEA experience
Advanced packaging technologies
Materials behavior knowledge
Proficiency with FEA tools
Collaboration with cross-functional teams
Education
Bachelor’s in Mechanical Engineering
Master’s degree
PhD in a related field
Tools
Ansys Classic/Mechanical
Abaqus
Job description
A technology startup in San Jose is seeking an experienced IC Package Mechanical FEA Engineer to develop high-performance packaging solutions for advanced ASICs. The ideal candidate will possess a Bachelor's in Mechanical Engineering or related field and have extensive experience with FEA tools and advanced packaging technologies. Responsibilities include performing simulations, collaborating with various teams, and supporting technology road-mapping. This role offers a unique opportunity to impact the future of AI-focused technologies.