Senior IC Packaging & SoC Integration Engineer

Apple Inc.; Austin (TX); On-site; USD 120,000 - 150,000; Full time

Job summary

Apple Inc. in Austin, Texas is looking for an IC Packaging Engineer to lead development efforts and drive innovation in packaging technologies.

We seek candidates with a strong background in semiconductor packaging, proven problem-solving abilities, and expertise in advanced packaging techniques. The role involves collaboration across teams to meet stringent performance specs while fostering a diverse and inclusive work environment.

Qualifications

• BS degree and 10+ years of experience in relevant industry.
• MS/PhD and 6+ years of experience is preferred.
• Experience in semiconductor packaging and system integration.

Responsibilities

• Responsible for IC packaging development.
• Work with cross-functional teams and lead SoC Package integration.
• Drive industry advancements with new material developments and specifications.

Skills

Semiconductor packaging

Problem solving

Advanced packaging technologies

Data analytics

Education

BS in relevant field

MS/PhD (preferred)

Tools

Allegro

Job description

Apple Inc. in Austin, Texas is looking for an IC Packaging Engineer to lead development efforts and drive innovation in packaging technologies.

We seek candidates with a strong background in semiconductor packaging, proven problem-solving abilities, and expertise in advanced packaging techniques. The role involves collaboration across teams to meet stringent performance specs while fostering a diverse and inclusive work environment.