Packaging Assembly Engineer

Apple Inc.; Austin (TX); On-site; USD 100,000 - 130,000; Full time

Job summary

A leading technology company in Austin, Texas is seeking an IC Packaging Assembly Engineer. The role involves owning the FCBGA assembly process from development through manufacturing, leading technology development, and ensuring high-quality standards. Candidates should have a BS with 10+ years of experience in the field, with a preference for advanced degrees. The position offers competitive challenges in a dynamic environment focused on cutting-edge technologies.

Qualifications

• BS and 10+ years of experience in relevant industry experience or equivalent.
• M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or related field is desired.
• 5+ years of extensive experience in Semiconductor Packaging field.

Responsibilities

• Define and optimize end-to-end FCBGA assembly process flow.
• Develop and maintain process documentation including process specs and work instructions.
• Plan and execute DOEs to improve yield, quality, and cost.

Skills

Materials characterization

Engineering problem solving

Communication

Process documentation

Education

BS in relevant field

M.S. or PhD in relevant field

Tools

APD

Virtuoso

Job description

Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.

Description

Responsible to lead packaging assembly technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Minimum 5% International travel.

Responsibilities

• Define and optimize end‑to‑end FCBGA assembly process flow (wafer back‑end interface, flip‑chip attach, underfill, lid/heat spreader attach, ball attach, singulation, final inspection).
• Develop and maintain process documentation including process specs, work instructions, control plans, PFMEA, and process flow diagrams.
• Plan and execute DOEs to improve yield, quality, and cost; analyze data using SPC and other statistical tools, and drive closure on findings.
• Lead root‑cause analysis and corrective actions for assembly excursions, yield issues, and customer returns, in collaboration with quality, reliability, and FA teams.
• Partner with substrate and package design teams to provide DFM input on pad/bump design, stack‑up, warpage control, and assembly design rules for FCBGA packages.
• Support NPI builds and ramp at OSAT sites: process window definition, buy‑off criteria, and transfer to volume manufacturing.
• Drive continuous improvement projects for cycle time, throughput, equipment uptime, and cost reduction while maintaining quality and reliability targets.
• Interface with equipment and materials suppliers to evaluate new tools, materials (underfill, solder, flux, lid attach, etc.), and technologies relevant to FCBGA assembly.

Minimum Qualifications

• BS and 10+ years of experience in relevant industry experience or equivalent

Preferred Qualifications

• M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field is desired.
• 5+ years of extensive experience in Semiconductor Packaging field. Working knowledge in materials characterization and analysis
• Working knowledge of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology. General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
• Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.
• Ability to work independently and take on projects with minimum supervision.
• Good engineering problem solving skills with strong engineering physics and fundamentals.
• Can use package design softwares, APD, Virtuoso, etc. Working knowledge in memory packaging.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant .

Apple accepts applications to this posting on an ongoing basis.