Senior IC Packaging Engineer – 2.5D & Automotive RFIC
Vivid Technology
San Jose (CA)
Hybrid
USD 120,000 - 150,000
Full time
14 days+
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Benefits offered by this job
401(k)
Vision insurance
Medical insurance
Paid maternity leave
Paid paternity leave
Tuition assistance
Job summary
A cutting-edge technology startup is seeking an IC Packaging Engineer to lead advanced multi-chip packaging solutions for THz-system RFIC and SoC applications. This mid-senior level role involves technical leadership and collaboration in a hybrid work environment based in the Bay Area. Candidates should have over 10 years of experience in IC packaging design, a strong background in RF integration, and a Master's or Ph.D. in a relevant field. The position offers competitive compensation and an opportunity to work on breakthrough ADAS technology.
Qualifications
10+ years of experience in IC packaging design and development, including leadership responsibilities.
Experience with multi-chip packages, digital and RF integration, and automotive applications.
Excellent communication skills and ability to thrive in a fast-paced start-up environment.
Responsibilities
Lead the design and execution of advanced IC packages for multi-chip RFIC/SoC integration.
Develop 2.5D packages with UCIe interconnects and interposer-based solutions.
Create and review electrical performance analysis and mechanical analysis.
Skills
IC packaging design
Technical leadership
Signal integrity
Thermal management
RF integration
Education
M.S. or Ph.D. in Mechanical Engineering
Tools
ANSYS
Job description
A cutting-edge technology startup is seeking an IC Packaging Engineer to lead advanced multi-chip packaging solutions for THz-system RFIC and SoC applications. This mid-senior level role involves technical leadership and collaboration in a hybrid work environment based in the Bay Area. Candidates should have over 10 years of experience in IC packaging design, a strong background in RF integration, and a Master's or Ph.D. in a relevant field. The position offers competitive compensation and an opportunity to work on breakthrough ADAS technology.