Senior FC-BGA ASIC Packaging Architect

K2 Space; Los Angeles (CA); On-site; USD 180,000 - 260,000; Full time

Benefits offered by this job

Equity

Comprehensive benefits

Job summary

K2 Space is seeking a Senior ASIC Package Design Engineer in Los Angeles to lead FC-BGA and MCM package architectures for high-pin-count ASICs. You will partner with silicon, RF, and systems teams, guiding standards and engaging OSATs through qualification and ramp.

The ideal candidate has 5+ years in ASIC packaging with FC-BGA expertise, strong SI/PI and thermal know-how, and proficiency with SIWave/HFSS/ADS. This role offers a competitive package and equity.

Qualifications

• 5+ years in ASIC package design with FC-BGA focus.
• Strong substrate, SI/PI fundamentals, thermal management.
• Fluent in SI/PI tools such as SIWave, HFSS, and ADS.

Responsibilities

• Define FC-BGA and MCM architectures for high-pin-count ASICs.
• Lead trade studies on cost, PI/SI, thermal, and reliability.
• Collaborate with silicon and systems teams on interfaces.
• Manage vendor relationships with OSATs and substrate suppliers.
• Drive package design standards and qualification activities.

Skills

FC-BGA expertise

MCM knowledge

SI/PI simulation

Thermal management

Education

Bachelor’s degree in Packaging Engineering or related field

Tools

SIWave

HFSS

ADS

OSAT vendors

Job description

K2 Space is seeking a Senior ASIC Package Design Engineer in Los Angeles to lead FC-BGA and MCM package architectures for high-pin-count ASICs. You will partner with silicon, RF, and systems teams, guiding standards and engaging OSATs through qualification and ramp.

The ideal candidate has 5+ years in ASIC packaging with FC-BGA expertise, strong SI/PI and thermal know-how, and proficiency with SIWave/HFSS/ADS. This role offers a competitive package and equity.