Senior Product Engineer — 3D Packaging & Yield Impact

University of Texas

Austin (TX)

On-site

USD 90,000 - 140,000

Full time

14 days+
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Benefits offered by this job

Competitive benefits package
LinkedIn Learning access
Tuition assistance
Staff library/museum access

Job summary

Texas Institute for Electronics at UT Austin is seeking a Product Engineer I–II or Senior Product Engineer to validate IC products, shape packaging solutions, and drive performance and reliability across heterogeneous micro-systems.

You will work with circuit/layout design, process integration, and test teams to define workflows, perform DOE studies, and leverage data analytics to optimize yield and reliability in a fast-paced, on‑site environment at Austin, Texas.

Qualifications

  • Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Computer Science, or Materials Science.
  • For Engineer II: minimum of 3 years relevant industry experience.
  • Senior: minimum of 10 years relevant industry experience.
  • Strong understanding of semiconductor device physics and mixed-signal IC behaviors.
  • Proficient in Python, MATLAB, C/C++, or Perl for data analysis and automation.
  • Strong communication and teamwork skills; able to collaborate cross-functionally.
  • Ability to thrive in a fast-paced environment and manage multiple projects.

Responsibilities

  • Validate product and test vehicles to specifications; develop and optimize manufacturing/test workflows.
  • Contribute to design and development of 2.5D/3D advanced packaging solutions.
  • Develop and support 3D-ADK (Assembly Design Kit).
  • Interpret fab metrology, defects, E-test yield; quantify process variations and impacts on performance.
  • Drive corrective actions across cross-functional teams to fix yield and reliability issues.
  • Perform failure analysis on products manufactured at TIE.
  • Collaborate with design teams to ensure package compatibility with die and system requirements.
  • Define and execute DOE studies; stay current with industry trends in packaging and design integration.
  • Leverage data analytics to drive yield and reliability optimization.
  • Own product life cycle from bring-up to customer qualification.

Skills

Python
MATLAB
C/C++
Perl
Communication

Education

Bachelor’s degree in Electrical Engineering or related field
Bachelor’s degree in Semiconductor Physics
Bachelor’s degree in Computer Science
Bachelor’s degree in Materials Science

Job description

Texas Institute for Electronics at UT Austin is seeking a Product Engineer I–II or Senior Product Engineer to validate IC products, shape packaging solutions, and drive performance and reliability across heterogeneous micro-systems.

You will work with circuit/layout design, process integration, and test teams to define workflows, perform DOE studies, and leverage data analytics to optimize yield and reliability in a fast-paced, on‑site environment at Austin, Texas.

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