Senior Product Engineer — 3D Packaging & Yield Impact

The University of Texas at Austin

Austin (TX)

On-site

USD 90,000 - 140,000

Full time

14 days+

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Competitive benefits package
LinkedIn Learning access
Tuition assistance
Staff library/museum access

Job summary

Texas Institute for Electronics at UT Austin is seeking a Product Engineer I–II or Senior Product Engineer to validate IC products, shape packaging solutions, and drive performance and reliability across heterogeneous micro-systems.

You will work with circuit/layout design, process integration, and test teams to define workflows, perform DOE studies, and leverage data analytics to optimize yield and reliability in a fast-paced, on‑site environment at Austin, Texas.

Qualifications

  • Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Computer Science, or Materials Science.
  • For Engineer II: minimum of 3 years relevant industry experience.
  • Senior: minimum of 10 years relevant industry experience.
  • Strong understanding of semiconductor device physics and mixed-signal IC behaviors.
  • Proficient in Python, MATLAB, C/C++, or Perl for data analysis and automation.
  • Strong communication and teamwork skills; able to collaborate cross-functionally.
  • Ability to thrive in a fast-paced environment and manage multiple projects.

Responsibilities

  • Validate product and test vehicles to specifications; develop and optimize manufacturing/test workflows.
  • Contribute to design and development of 2.5D/3D advanced packaging solutions.
  • Develop and support 3D-ADK (Assembly Design Kit).
  • Interpret fab metrology, defects, E-test yield; quantify process variations and impacts on performance.
  • Drive corrective actions across cross-functional teams to fix yield and reliability issues.
  • Perform failure analysis on products manufactured at TIE.
  • Collaborate with design teams to ensure package compatibility with die and system requirements.
  • Define and execute DOE studies; stay current with industry trends in packaging and design integration.
  • Leverage data analytics to drive yield and reliability optimization.
  • Own product life cycle from bring-up to customer qualification.

Skills

Python
MATLAB
C/C++
Perl
Communication

Education

Bachelor’s degree in Electrical Engineering or related field
Bachelor’s degree in Semiconductor Physics
Bachelor’s degree in Computer Science
Bachelor’s degree in Materials Science

Job description

Texas Institute for Electronics at UT Austin is seeking a Product Engineer I–II or Senior Product Engineer to validate IC products, shape packaging solutions, and drive performance and reliability across heterogeneous micro-systems.

You will work with circuit/layout design, process integration, and test teams to define workflows, perform DOE studies, and leverage data analytics to optimize yield and reliability in a fast-paced, on‑site environment at Austin, Texas.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Yield Enhancement Engineer – Semiconductor Packaging & NPI
Yield Enhancement Engineer – Semiconductor Packaging & NPI

The University of Texas at Austin • Austin (TX)

On-site
USD 80,000 - 100,000
Competitive health benefits
Voluntary insurance options
Tuition assistance
Senior Failure Analysis Engineer - 3D Packaging Metrology
Senior Failure Analysis Engineer - 3D Packaging Metrology

University of Texas at Austin • Austin (TX)

On-site
USD 90,000 - 140,000
Semiconductor Equipment Engineer – Packaging & Lithography
Semiconductor Equipment Engineer – Packaging & Lithography

The University of Texas at Austin • United States

On-site
USD 90,000 - 120,000
Competitive health benefits
Tuition assistance
Paid time off
+1
Senior Product Engineer, Power Systems/Packaging (Hybrid)
Senior Product Engineer, Power Systems/Packaging (Hybrid)

IC Resources • Austin (TX)

Hybrid
USD 120,000 - 160,000
Senior Failure Analysis Engineer – 3D Packaging Metrology
Senior Failure Analysis Engineer – 3D Packaging Metrology

The University of Texas at Austin • United States

On-site
USD 90,000 - 140,000
Competitive health benefits
Paid time off
Tuition assistance
Impactful Semiconductor Packaging Engineer Intern (MS/PhD)
Impactful Semiconductor Packaging Engineer Intern (MS/PhD)

Texas Instruments • United States

On-site
USD 90,000 - 140,000
Advanced Semiconductor Packaging Engineer
Advanced Semiconductor Packaging Engineer

Texas Instruments • Dallas (TX)

On-site
USD 70,000 - 100,000
Yield Enhancement Engineer, Texas Institute for Electronics
Yield Enhancement Engineer, Texas Institute for Electronics

The University of Texas at Austin • Austin (TX)

On-site
USD 80,000 - 100,000
Competitive health benefits
Voluntary insurance options
Tuition assistance
Equipment Engineer — Semiconductor Packaging & Process
Equipment Engineer — Semiconductor Packaging & Process

The University of Texas at Austin • Austin (TX)

On-site
USD 70,000 - 100,000
Competitive health benefits
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
+2
IC Packaging & Integration Lead — Drive Innovative Solutions
IC Packaging & Integration Lead — Drive Innovative Solutions

Apple Inc. • Austin (TX)

On-site
USD 130,000 - 160,000