Principal Engineer, Advanced Packaging Innovation

Micron Technology, Inc; Boise (ID); On-site; USD 100,000 - 150,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time-off and holidays

Income protection programs

Job summary

A leading semiconductor firm in Boise seeks a Principal Engineer to join its Advanced Package Technology Development team. This role includes defining requirements and driving innovations in semiconductor packaging technologies. Candidates should possess over 5 years of experience in this field and a relevant degree with specific knowledge in high bandwidth memory and 3D integration strategies. The position offers competitive benefits and opportunities for professional growth.

Qualifications

• Deep knowledge of 2.5D and 3D integration strategies including Hybrid bonding.
• Experience in Wafer Level Packaging or 3D stacking processes.
• Consult and influence technical decisions at senior management levels.

Responsibilities

• Define requirements with proven technical data and content.
• Drive technical innovation for business value.
• Collaborate with internal and external partners.

Skills

Over 5 years of professional experience in semiconductor advanced packaging

Deep knowledge of High Bandwidth Memory

Hands-on process module engineering experience

Experience in DRAM manufacturing

Education

BS, MS, or Ph.D. in relevant fields

Job description

A leading semiconductor firm in Boise seeks a Principal Engineer to join its Advanced Package Technology Development team. This role includes defining requirements and driving innovations in semiconductor packaging technologies. Candidates should possess over 5 years of experience in this field and a relevant degree with specific knowledge in high bandwidth memory and 3D integration strategies. The position offers competitive benefits and opportunities for professional growth.