Senior Director, Packaging & Assembly Engineering - NPI Leader

Renesas Electronics; San Jose (CA); On-site; USD 230,000 - 290,000; Full time

Benefits offered by this job

Medical insurance

Health savings account (HSA)

Dental and vision insurance

Paid time off & holidays

Job summary

Renesas Electronics in San Jose, CA seeks a Senior Director for Package & Assembly Engineering to lead packaging development, NPI execution, and assembly engineering improvements. You will partner with Design, Application, Marketing, Product, Reliability, Quality, and Operations across OSATs to meet schedules and quality goals.

This senior leadership role requires 15–20+ years in semiconductor packaging, a proven track record in NPI programs, and the ability to build and mentor global teams.

Qualifications

• 15–20+ years of relevant semiconductor engineering and program management experience.
• Experience leading NPI programs involving package development, assembly, and ramp.
• Strong OSAT/CM collaboration and global program execution capabilities.
• Proven ability to manage critical path, risks, and executive reporting.

Responsibilities

• Recruit, build and mentor a team of Packaging engineers.
• Lead end-to-end NPI program plans with milestones and risk management.
• Establish governance, dashboards, and executive reporting for visibility.
• Drive cross-functional task forces to resolve quality, yield, and schedule issues.
• Coordinate with Design, Application, Marketing, Product, Reliability and Operations teams.

Skills

Executive leadership

Program management

Cross-functional leadership

NPI program management

Risk management

OSAT/CM collaboration

Data-driven problem solving

Executive communication

Education

Bachelor’s or higher in Electrical Engineering

Job description

Renesas Electronics in San Jose, CA seeks a Senior Director for Package & Assembly Engineering to lead packaging development, NPI execution, and assembly engineering improvements. You will partner with Design, Application, Marketing, Product, Reliability, Quality, and Operations across OSATs to meet schedules and quality goals.

This senior leadership role requires 15–20+ years in semiconductor packaging, a proven track record in NPI programs, and the ability to build and mentor global teams.