Director, Power SiP Packaging & Wafer-Scale Interconnect

Renesas Electronics

Austin (TX)

On-site

USD 160,000 - 230,000

Full time

11 days ago

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Benefits offered by this job

Competitive benefits package

Job summary

Renesas Electronics is seeking a senior packaging engineer to lead development and qualification of advanced power packaging, SiP and wafer-level technologies. You will oversee DOE, supplier collaboration with OSAT/CM, and ensure smooth ramp into production.

The role requires deep technical knowledge in power packaging, wire-bonding, and multi-chip modules, with an emphasis on reliability and process control within a global organization.

Qualifications

  • Advanced degree in physics, chemistry, mechanical, electrical, or materials engineering.
  • Extensive experience in power SiP/module and wafer level packaging.
  • Familiarity with wire-bonding and multi-chip module technologies.

Responsibilities

  • Package Technology Development/NPI and OSAT management for new packaging programs.
  • Design and develop package and interconnect methods for AI/datacenter power packaging.
  • Qualify materials and subcontractors; run DOE to optimize processes.
  • Collaborate with Product and Reliability teams to qualify new packages.
  • Ensure production ramp up and monitor quality across production phases.
  • Address internal/external customer issues and drive ongoing improvements.

Skills

Power packaging
Wafer level packaging
Flip-chip packaging
DOE optimization
OSAT collaboration

Education

PhD/MS/BS in Physics/ Chemistry/ Mechanical/ Electrical/ Materials Engineering

Tools

SPC software
Statistical analysis

Job description

Renesas Electronics is seeking a senior packaging engineer to lead development and qualification of advanced power packaging, SiP and wafer-level technologies. You will oversee DOE, supplier collaboration with OSAT/CM, and ensure smooth ramp into production.

The role requires deep technical knowledge in power packaging, wire-bonding, and multi-chip modules, with an emphasis on reliability and process control within a global organization.

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