Senior Director, Packaging & Assembly NPI Excellence

Renesas Electronics Corporation; San Jose (CA); Hybrid; USD 230,000 - 290,000; Full time

Job summary

Renesas Electronics is seeking a Sr. Director to lead the packaging development, NPI, and assembly engineering organization.

This role partners with Package Design, Development Engineering Directors, Design, Application, Marketing, Product, Reliability, Quality, Operations, and Supply Chain to meet schedules, quality, and long-term improvements. Extensive experience in semiconductor packaging and global OSAT collaboration is required.

Qualifications

• 15–20+ years of relevant experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, technical program management, or related field.
• Experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
• Strong understanding of semiconductor product development process, package and assembly processes.
• Experience working with OSATs/CMs and managing complex development and production activities across distributed organizations.
• Proven track record leading cross-functional technical task forces to resolve issues affecting quality, reliability, yield, manufacturability, or schedule.
• Strong program management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment
• Strong interpersonal, communication, negotiation, and executive presentation skills

Responsibilities

• Recruit and mentor a new team of packaging engineers.
• Lead program-level execution, governance, and accountability for development programs.
• Establish end-to-end NPI program plans with milestones and risk management.
• Create a disciplined program management operating model for development to volume manufacturing.
• Identify and mitigate technical, quality, reliability, and schedule risks with clear recommendations.
• Lead cross-functional task forces to resolve major development challenges.
• Drive data-driven problem solving with root-cause analysis and corrective actions.
• Coordinate with Design, Application, Marketing, Product Engineering, Reliability, Quality, and Operations teams to remove barriers.
• Establish dashboards for milestones, risks, issues, and recovery plans.
• Manage OSAT/CM partner programs, reviews, escalation, and ramp execution.
• Ensure timely EBR completion at OSATs and track progress for recovery actions.
• Develop and lead package and assembly teams at OSATs aligned with priorities.

Skills

Leadership

Program management

Cross-functional collaboration

Executive communication

Risk management

Analytical skills

Education

Doctorate, Master’s, or Bachelor’s Degree in Electrical Engineering or related field

Job description

Renesas Electronics is seeking a Sr. Director to lead the packaging development, NPI, and assembly engineering organization.

This role partners with Package Design, Development Engineering Directors, Design, Application, Marketing, Product, Reliability, Quality, Operations, and Supply Chain to meet schedules, quality, and long-term improvements. Extensive experience in semiconductor packaging and global OSAT collaboration is required.