Senior Die Bonding Process Engineer: Yield & Innovation

Micron Technology; Boise (ID); On-site; USD 100,000 - 140,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Paid time-off program

Job summary

Micron Technology in Boise, Idaho is seeking a Principal Process Engineer in Die Bonding. The role involves developing and optimizing semiconductor processes to enhance product quality and reliability. With emphasis on die bonding technologies, the position requires a minimum of 8 years of experience and a BS degree in Engineering. Preferred candidates may hold a Master's or Doctorate. Micron offers a comprehensive benefits package including healthcare, paid time-off, and professional growth opportunities.

Qualifications

• Minimum 8+ years proven experience in Semiconductor Process Engineering.
• Solid knowledge of advanced packaging die stacking processes.
• Skilled at designing valid tests and Data Analysis.

Responsibilities

• Develop, diagnose, and resolve die bonding process technologies.
• Coordinate process optimization initiatives.
• Lead yield improvement and cost reduction activities.

Skills

Semiconductor Process Engineering

Data Analysis

Project Management

Team Collaboration

Education

BS degree in Engineering

Master's or Doctorate preferred

Tools

Design of Experiments (DOE)

FMEA

SPC/FDC methodology

Job description

Micron Technology in Boise, Idaho is seeking a Principal Process Engineer in Die Bonding. The role involves developing and optimizing semiconductor processes to enhance product quality and reliability. With emphasis on die bonding technologies, the position requires a minimum of 8 years of experience and a BS degree in Engineering. Preferred candidates may hold a Master's or Doctorate. Micron offers a comprehensive benefits package including healthcare, paid time-off, and professional growth opportunities.