Principal Process Engineer, Die Bonding

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Paid holidays

Job summary

1000 Micron Technology, Inc. is seeking a Principal Process Engineer specializing in Die Bonding. This role involves optimizing semiconductor processes to enhance quality and reliability, addressing manufacturing challenges, and leading continuous improvement initiatives.

Applicants should possess a BS degree along with a minimum of 8 years of relevant experience, ideally with expertise in advanced packaging technologies. Strong communication skills and the ability to work independently and collaboratively are essential. Micron offers a comprehensive benefits package.

Qualifications

• 8+ years of experience in Semiconductor Process Engineering.
• Knowledge of semiconductor advanced packaging die stacking processes.
• Excellent data collection, organization, and analysis skills.

Responsibilities

• Develop and optimize die bonding process technologies.
• Coordinate and implement process evaluation initiatives.
• Lead yield improvement and cost reduction activities.

Skills

Semiconductor Process Engineering

Process yield improvement

Failure analysis

Design of Experiments (DOE)

Strong communication skills

Education

BS degree in Engineering or related field

Masters or Doctorate degree preferred

Tools

Statistical Process Control (SPC)

Root Cause Analysis tools

Job description

Overview

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage interconnects and packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next‑generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron’s leadership in the industry. As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Responsibilities

• Develop, diagnose, and resolve various die bonding process technologies.
• Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step.
• Lead and participate in continuous yield improvement and cost reduction activities.
• Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction.
• Manage, audit, and liaise with material suppliers to achieve quality, cost, and risk management objectives.
• Support SPC/FDC/RMS/APC and site-to-site portability.
• Support internal and external audits.

Minimum Qualifications

• BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering.
• Solid engineering knowledge of semiconductor advanced packaging die stacking processes.
• Skilled at designing valid tests and Design of Experiments (DOE).
• Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs.
• Excellent oral and written communication skills and strong attention to detail.
• Highly self‑motivated and able to work independently, as a group leader, and as a collaborative contributor.
• Knowledge and understanding of project management.

Preferred Qualifications

• Masters or Doctorate degree in Engineering, Physics, or related field.
• Experience working on Die Bonding: Fusion Bonding, Hybrid Bonding, Direct Bonding, or applications such as MEMS, Imager, Memory or Heterogeneous Integration Bonding.
• Bonding experience at a vendor, research institute, or semiconductor industry equipment supplier or integrator.

Benefits

Micron offers a choice of medical, dental, and vision plans, benefits that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, pay time‑off and paid holidays are provided. For more information, see micron.com/careers/benefits.

Equal Opportunity Statement

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.