Die Bonding Process Engineering Lead

Micron Technology, Inc; Boise (ID); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid family leave

Job summary

Micron Technology, Inc in Boise, Idaho is looking for a Principal Process Engineer to lead die bonding technology advancements. The ideal candidate should have a BS degree combined with at least 8 years of experience in semiconductor process engineering. Responsibilities include developing and optimizing processes, validating new technologies, and managing supplier relationships. Micron offers comprehensive benefits, including medical, paid leave, and a robust paid time-off program.

Qualifications

• 8+ years proven experience in semiconductor process engineering.
• Solid engineering knowledge of semiconductor advanced packaging processes.
• Skilled at designing valid tests and Design of Experiments (DOE).

Responsibilities

• Develop and optimize die bonding process technologies.
• Coordinate process, equipment, and material evaluation initiatives.
• Lead continuous yield improvement and cost reduction activities.

Skills

Semiconductor Process Engineering

Data Analysis

Communication Skills

Project Management

Education

BS degree in Engineering

Masters or Doctorate in Engineering or related field

Job description

Micron Technology, Inc in Boise, Idaho is looking for a Principal Process Engineer to lead die bonding technology advancements. The ideal candidate should have a BS degree combined with at least 8 years of experience in semiconductor process engineering. Responsibilities include developing and optimizing processes, validating new technologies, and managing supplier relationships. Micron offers comprehensive benefits, including medical, paid leave, and a robust paid time-off program.