Wafer Bonding Process Engineer: Advanced Development

Micron Technology, Inc; Boise (ID); On-site; USD 75,000 - 95,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid family leave

Paid time-off program

Paid holidays

Job summary

Micron Technology, Inc in Boise, Idaho is seeking experienced Process Engineers to develop process technology for wafer bonding. Candidates should have a strong background in materials or chemical engineering and hands-on experience with wafer bonding.

The role involves process ownership, collaborating with multifunctional teams, and optimizing processes to align with DRAM roadmap requirements. Micron offers competitive benefits and values diversity in the workplace.

Qualifications

• Bachelor's in a relevant field or equivalent experience.
• 3+ years of hands-on experience in wafer bonding.
• Knowledge of DRAM or other memory.
• Effective communication skills.

Responsibilities

• Developing process technology for wafer bonding.
• Collaborating with teams to develop engineering solutions.
• Optimizing processes to reduce costs and improve capability.
• Managing process flow related to area equipment.

Skills

Process ownership

Problem-solving

Leadership skills

Teamwork

Education

Bachelor of Science + 3 years experience or Master of Science/PhD

Tools

Wafer bonding

Photolithography

Wet process

Thin films

Wafer thinning (grind and CMP)

Job description

Micron Technology, Inc in Boise, Idaho is seeking experienced Process Engineers to develop process technology for wafer bonding. Candidates should have a strong background in materials or chemical engineering and hands-on experience with wafer bonding.

The role involves process ownership, collaborating with multifunctional teams, and optimizing processes to align with DRAM roadmap requirements. Micron offers competitive benefits and values diversity in the workplace.