Senior Wafer Bonding Process Engineer

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 210,000; Full time

Benefits offered by this job

Health benefits

Savings plans

Wellbeing programs

Stock purchase discount

Generous time off

Job summary

Micron Technology, Inc. in Boise, Idaho seeks a Staff/Principal Wafer Bonding Process Engineer to lead next‑gen DRAM bonding processes. You will plan experiments, improve yield, reduce costs, and drive productivity using data‑driven, AI‑assisted approaches.

You will evaluate new equipment and materials, mentor teams, and collaborate across multiple functions to ensure manufacturing readiness and quality at scale.

Qualifications

• PhD with 3+ years, Master’s with 5+ years, or Bachelor’s with 7+ years semiconductor experience.
• 5+ years in wafer bonding, process integration, or related semiconductor manufacturing processes.
• Hands-on with direct/hybrid bonding, wafer thinning, debonding, or related bonding tech.

Responsibilities

• Develop and optimize wafer bonding processes for next‑gen DRAM.
• Plan and execute DOEs to improve process performance and reliability.
• Drive yield improvement, cost reduction, and productivity initiatives with data-driven methods.
• Evaluate and qualify new equipment, materials, and processes for development and manufacturing.
• Collaborate with manufacturing, suppliers, and cross‑functional teams to implement improvements.
• Apply AI/ML/LLM tools to solve complex problems and accelerate innovation.

Skills

Wafer bonding

DOE planning

Data-driven problem solving

AI/ML tools

Cross-functional teamwork

Process optimization

Education

PhD

Master's degree

Bachelor's degree

Job description

Micron Technology, Inc. in Boise, Idaho seeks a Staff/Principal Wafer Bonding Process Engineer to lead next‑gen DRAM bonding processes. You will plan experiments, improve yield, reduce costs, and drive productivity using data‑driven, AI‑assisted approaches.

You will evaluate new equipment and materials, mentor teams, and collaborate across multiple functions to ensure manufacturing readiness and quality at scale.