Lead Die Bonding Process Engineer – Yield & Innovation

Micron Technology, Inc; Boise (ID); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid family leave

Generous paid time off

Job summary

Micron Technology, Inc is seeking a Principal Process Engineer to enhance die bonding processes and improve product quality and reliability. This role focuses on optimizing production methods and resolving manufacturing issues while collaborating with suppliers and conducting internal audits.

The ideal candidate will have at least 8 years of semiconductor experience, a BS degree in a relevant field, and strong communication skills. Benefits include medical, dental, and vision plans as well as generous paid time off.

Qualifications

• Minimum 8 years proven experience in Semiconductor Process Engineering.
• Knowledge of semiconductor advanced packaging die stacking processes.
• Excellent oral and written communication skills with attention to detail.

Responsibilities

• Develop and resolve die bonding process technologies.
• Coordinate process and equipment evaluation and optimization.
• Lead continuous yield improvement and cost reduction activities.

Skills

Semiconductor Process Engineering

Failure analysis

Data analysis techniques

Communication skills

Project management

Education

BS degree in Engineering, Physics, or related field

Masters or Doctorate degree

Job description

Micron Technology, Inc is seeking a Principal Process Engineer to enhance die bonding processes and improve product quality and reliability. This role focuses on optimizing production methods and resolving manufacturing issues while collaborating with suppliers and conducting internal audits.

The ideal candidate will have at least 8 years of semiconductor experience, a BS degree in a relevant field, and strong communication skills. Benefits include medical, dental, and vision plans as well as generous paid time off.