Senior Process Engineer: Chip-to-Wafer & Hybrid Bonding

Micron Technology, Inc; Boise (ID); On-site; USD 130,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Paid time-off program

Job summary

Micron Technology, Inc in Boise, Idaho is seeking a Senior Process Engineering Technical Leader to advance chip-to-wafer and hybrid bonding processes for innovative 3D memory products. This role requires a Master’s or PhD and 13+ years of semiconductor R&D experience.

You will lead multidisciplinary efforts that bridge early development to high-volume manufacturing, ensuring product reliability and performance. The position offers comprehensive benefits including medical options, paid time off, and family leave.

Join Micron and contribute to transforming how the world uses information.

Qualifications

• 13+ years of semiconductor R&D experience.
• 10+ years in advanced packaging.
• Ability to lead without formal authority.

Responsibilities

• Set technical direction for bonding processes.
• Develop and mature process flows and materials.
• Drive technology transfer into manufacturing.

Skills

Leadership of multi-team technical efforts

Expertise in bonding processes

Problem-solving

Education

Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering

Job description

Micron Technology, Inc in Boise, Idaho is seeking a Senior Process Engineering Technical Leader to advance chip-to-wafer and hybrid bonding processes for innovative 3D memory products. This role requires a Master’s or PhD and 13+ years of semiconductor R&D experience.

You will lead multidisciplinary efforts that bridge early development to high-volume manufacturing, ensuring product reliability and performance. The position offers comprehensive benefits including medical options, paid time off, and family leave.

Join Micron and contribute to transforming how the world uses information.