Principal Process Engineer, Die Bonding

Micron Technology, Inc.; Boise (ID); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Robust paid time-off program

Paid holidays

Job summary

Micron Technology, Inc. seeks a Principal Process Engineer specializing in die bonding processes in Boise, Idaho. This role involves developing and optimizing semiconductor packaging processes, improving product quality, and managing supplier relationships.

The ideal candidate will have over 8 years of experience in semiconductor process engineering and a solid knowledge of die stacking processes. Excellent communication skills and a collaborative approach are essential. Micron offers comprehensive benefits, including healthcare and paid time off.

Qualifications

• Minimum 8+ years proven experience in Semiconductor Process Engineering.
• Solid engineering knowledge of die bonding processes.
• Excellent data collection and analysis skills.

Responsibilities

• Develop and resolve die bonding process technologies.
• Coordinate process and material evaluation/optimization initiatives.
• Lead yield improvement and cost reduction activities.

Skills

Semiconductor advanced packaging die stacking processes

Data analysis skills

Design of Experiments (DOE)

Process yield improvement

Failure analysis

Education

BS degree in Engineering

Masters or Doctorate degree in Engineering or related field

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next‑generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry.

As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Responsibilities

• Develop, diagnose, and resolve various die bonding process technologies
• Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step
• Lead and participate in continuous yield improvement and cost reduction activities
• Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
• Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives
• Support SPC/FDC/RMS/APC and site‑to‑site portability
• Support internal and external audits

Minimum Qualifications

• A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering
• Solid engineering knowledge of semiconductor advanced packaging die stacking processes
• Skilled at designing valid tests and Design of Experiments (DOE)
• Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs
• Excellent oral and written communication skills and a strong attention to detail
• Highly self‑motivated and have the ability to work independently, as a group leader, and as a collaborative contributor
• Knowledge and an understanding of project management

Preferred Qualifications

• Masters or Doctorate degree in Engineering, Physics, or related field
• Experience in working on Die Bonding: Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration
• Bonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or Integrator

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here. (http://www.justice.gov/crt/worker-information)

To learn more about Micron, please visit micron.com/careers

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.