Senior Die Bonding Process Engineer - Packaging & Yield

1000 Micron Technology, Inc.

Boise (ID)

On-site

USD 100,000 - 130,000

Full time

14 days+

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Medical, dental, and vision plans
Paid family leave
Paid holidays

Job summary

1000 Micron Technology, Inc. is seeking a Principal Process Engineer specializing in Die Bonding. This role involves optimizing semiconductor processes to enhance quality and reliability, addressing manufacturing challenges, and leading continuous improvement initiatives.

Applicants should possess a BS degree along with a minimum of 8 years of relevant experience, ideally with expertise in advanced packaging technologies. Strong communication skills and the ability to work independently and collaboratively are essential. Micron offers a comprehensive benefits package.

Qualifications

  • 8+ years of experience in Semiconductor Process Engineering.
  • Knowledge of semiconductor advanced packaging die stacking processes.
  • Excellent data collection, organization, and analysis skills.

Responsibilities

  • Develop and optimize die bonding process technologies.
  • Coordinate and implement process evaluation initiatives.
  • Lead yield improvement and cost reduction activities.

Skills

Semiconductor Process Engineering
Process yield improvement
Failure analysis
Design of Experiments (DOE)
Strong communication skills

Education

BS degree in Engineering or related field
Masters or Doctorate degree preferred

Tools

Statistical Process Control (SPC)
Root Cause Analysis tools

Job description

1000 Micron Technology, Inc. is seeking a Principal Process Engineer specializing in Die Bonding. This role involves optimizing semiconductor processes to enhance quality and reliability, addressing manufacturing challenges, and leading continuous improvement initiatives.

Applicants should possess a BS degree along with a minimum of 8 years of relevant experience, ideally with expertise in advanced packaging technologies. Strong communication skills and the ability to work independently and collaboratively are essential. Micron offers a comprehensive benefits package.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Senior Die Bonding Process Engineer: Yield & Innovation
Senior Die Bonding Process Engineer: Yield & Innovation

Micron Technology • Boise (ID)

On-site
USD 100,000 - 140,000
Lead Die Bonding Process Engineer – Yield & Innovation
Lead Die Bonding Process Engineer – Yield & Innovation

Micron Technology, Inc • Boise (ID)

On-site
USD 100,000 - 130,000
Medical, dental and vision plans
Paid family leave
Generous paid time off
Principal Process Engineer, Die Bonding
Principal Process Engineer, Die Bonding

Micron Technology, Inc • Boise (ID)

On-site
USD 100,000 - 130,000
Medical, dental and vision plans
Paid family leave
Generous paid time off
Principal Process Engineer, Die Bonding
Principal Process Engineer, Die Bonding

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 100,000 - 130,000
Medical, dental, and vision plans
Paid family leave
Paid holidays
Principal Process Engineer, Die Bonding
Principal Process Engineer, Die Bonding

Micron Technology, Inc. • Boise (ID)

On-site
USD 100,000 - 130,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
+1
Principal Die Bonding Process Engineer: Drive Yield
Principal Die Bonding Process Engineer: Drive Yield

Micron Technology, Inc. • Boise (ID)

On-site
Principal Process Engineer, Die Bonding
Principal Process Engineer, Die Bonding

Micron Technology • Boise (ID)

On-site
USD 100,000 - 140,000
Medical, dental, and vision plans
Paid family leave
Paid time-off program
Die Bonding Process Engineering Lead
Die Bonding Process Engineering Lead

Micron Technology, Inc • Boise (ID)

On-site
USD 100,000 - 130,000
Medical, dental, and vision plans
Paid time off
Paid family leave
Senior Fab Process Engineer — Yield & Reliability Impact
Senior Fab Process Engineer — Yield & Reliability Impact

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 80,000 - 110,000
Medical, dental, and vision plans
Paid family leave
Paid time-off program
+1
Senior Process Engineering Technical Leader
Senior Process Engineering Technical Leader

Micron Technology, Inc • Boise (ID)

On-site
USD 130,000 - 160,000
Medical, dental and vision plans
Paid family leave
Robust paid time-off program