Principal Process Engineer, Die Bonding

Micron Technology, Inc; Boise (ID); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid family leave

Generous paid time off

Job summary

Micron Technology, Inc is seeking a Principal Process Engineer to enhance die bonding processes and improve product quality and reliability. This role focuses on optimizing production methods and resolving manufacturing issues while collaborating with suppliers and conducting internal audits.

The ideal candidate will have at least 8 years of semiconductor experience, a BS degree in a relevant field, and strong communication skills. Benefits include medical, dental, and vision plans as well as generous paid time off.

Qualifications

• Minimum 8 years proven experience in Semiconductor Process Engineering.
• Knowledge of semiconductor advanced packaging die stacking processes.
• Excellent oral and written communication skills with attention to detail.

Responsibilities

• Develop and resolve die bonding process technologies.
• Coordinate process and equipment evaluation and optimization.
• Lead continuous yield improvement and cost reduction activities.

Skills

Semiconductor Process Engineering

Failure analysis

Data analysis techniques

Communication skills

Project management

Education

BS degree in Engineering, Physics, or related field

Masters or Doctorate degree

Job description

Micron Technology

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Principal Process Engineer – Die Bonding

As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Responsibilities

• Develop, diagnose, and resolve various die bonding process technologies
• Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step
• Lead and participate in continuous yield improvement and cost reduction activities
• Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
• Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk management objectives
• Support SPC/FDC/RMS/APC and site-to-site portability
• Support internal and external audits

Minimum Qualifications

• A BS degree with minimum 8+ years proven experience in Semiconductor Process Engineering
• Solid engineering knowledge of semiconductor advanced packaging die stacking processes
• Skilled at designing valid tests and Design of Experiments (DOE)
• Excellent data collection, organization, and analysis skills, plus proficiency in data analysis techniques/programs
• Excellent oral and written communication skills and a strong attention to detail
• Highly self‑motivated and have the ability to work independently, as a group leader, and as a collaborative contributor
• Knowledge and an understanding of project management

Preferred Qualifications

• Masters or Doctorate degree in Engineering, Physics, or related field
• Experience in working on Die Bonding: Fusion Bonding, Hybrid Bonding, Direct Bonding, or on applications such as MEMS, Imager, Memory or Heterogeneous Integration
• Bonding experience at a Vendor, Research Institute or Semiconductor Industry Equipment Supplier or Integrator

Job Profile(s)

Semiconductor Process Engineer 5

Relocation Level: TBD

Benefits

Micron offers a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

Equal Opportunity Employer

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.