Senior Process Engineer — Bonding & 3D Memory Tech

Micron Technology; Boise (ID); On-site; USD 130,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Robust paid time-off program

Job summary

Micron Technology in Boise, Idaho is seeking a Senior Process Engineering Technical Leader to oversee chip-to-wafer and hybrid bonding processes. This role includes setting technical direction, leading multi-team efforts, and developing processes for high-performance 3D memory products. Candidates should possess a Master’s or PhD in a related field, with extensive semiconductor R&D and advanced packaging experience. Micron offers a comprehensive benefits package to support wellbeing and growth.

Qualifications

• 13+ years of semiconductor R&D experience, with 10+ years in advanced packaging.
• Ability to lead technical efforts without formal authority.
• Experience in guiding FOAK process or equipment development.

Responsibilities

• Set technical direction for chip-to-wafer and hybrid bonding processes.
• Develop process flows and materials meeting performance and cost needs.
• Lead problem solving across wafer fab and bonding interactions.
• Partner with teams to drive technology transfer into manufacturing.
• Ensure repeatability and high-volume readiness.

Skills

Leadership in multi-team technical efforts

Bonding process expertise

Problem-solving

Technical direction setting

Education

Master’s degree or PhD in related field

Job description

Micron Technology in Boise, Idaho is seeking a Senior Process Engineering Technical Leader to oversee chip-to-wafer and hybrid bonding processes. This role includes setting technical direction, leading multi-team efforts, and developing processes for high-performance 3D memory products. Candidates should possess a Master’s or PhD in a related field, with extensive semiconductor R&D and advanced packaging experience. Micron offers a comprehensive benefits package to support wellbeing and growth.