Senior Advanced Packaging & Integration Technologist

Biopharma Careers; Tempe (AZ); On-site; USD 179,000 - 288,000; Full time

Benefits offered by this job

Health insurance

Paid time off

Retirement contributions

Job summary

EMD Electronics is seeking a strategic and technically expert professional to define the High Performance Packaging opportunity, engage industry ecosystems, and develop programs from concept to transfer to high-volume manufacturing. You will work with BU partners and CTO to shape solutions and datasets for rapid progression.

The role emphasizes cross-functional leadership, external collaboration, and staying ahead of packaging technology inflection points, with preferred locations in Tempe, AZ.

Qualifications

• MSc or higher in Mechanical, Electrical, Chemical Engineering or related field.
• 10+ years of 300mm process/equipment R&D hands-on experience in Advanced Packaging (300mm) equipment tool ownership.
• Advanced Packaging thin films deposition CMP bonding or patterning process development.
• Developing integration and process flows and cross-functional collaboration.

Responsibilities

• Identify and stay ahead of key High Performance Packaging technology inflection points and roadmaps.
• Acquire in-depth strategic knowledge of customer and OEM roadmaps through industry/ecosystem connections.
• Transfer knowledge to peers on High Performance Packaging roadmaps across organization.
• Identify material solutions and developments to address industry challenges across BU’s and CTO office.
• Engage ecosystem for collaborative development opportunities using industry networks.

Skills

Advanced Packaging

Process R&D

External collaboration

Education

MSc or higher in Mechanical, Electrical, or Chemical Engineering

Tools

Equipment Tool ownership

Job description

EMD Electronics is seeking a strategic and technically expert professional to define the High Performance Packaging opportunity, engage industry ecosystems, and develop programs from concept to transfer to high-volume manufacturing. You will work with BU partners and CTO to shape solutions and datasets for rapid progression.

The role emphasizes cross-functional leadership, external collaboration, and staying ahead of packaging technology inflection points, with preferred locations in Tempe, AZ.