Senior Advanced Packaging Integration Technologist

Merck KGa A,Darmstadt,Germany; United States; On-site; USD 136,000 - 204,000; Full time

Benefits offered by this job

Health insurance

PTO

Retirement contributions

Job summary

EMD Electronics in the United States is seeking a leader to develop High Performance Packaging opportunities, engage ecosystem and drive program development from idea to proof of concept for transfer to high volume manufacturing.

The ideal candidate will combine deep knowledge of 300mm Advanced Packaging technologies with a broad ecosystem network, including equipment suppliers and IDM/Foundry/Memory customers.

Qualifications

• MSc or higher in Mechanical Eng, Electrical Eng, Chem Eng or related engineering fields.
• 8 Years 300mm Process/ Equipment R&D hands on experience.
• Advanced Packaging (300mm) Equipment Tool owner.
• Advanced Packaging Thin Films Dep/CMP/Bonding or Patterning Process development.
• Experience developing integration and process flows.
• Experience collaborating with external business developments.
• SOW (Scope of Work)/ POC (Proof of Concept)/DOE’s on equip/material definition.

Responsibilities

• Through technical expertise identify and stay ahead of key High Performance Packaging (Advanced Packaging) technology inflection points and roadmaps.
• Transfer knowledge/educate peers on High Performance Packaging roadmaps.
• Leverage industry knowledge to identify process/equipment/integration challenges.
• Work across BU’s and CTO office to identify material solutions/developments to solve industry challenges.
• Leverage industry network and connections to engage the ecosystem on collaborative development opportunities.

Skills

Advanced Packaging

Education

MSc or higher in Mechanical/Electrical/Chemical Eng or related engineering fields

Tools

Advanced Packaging Equipment Tool owner

Job description

EMD Electronics in the United States is seeking a leader to develop High Performance Packaging opportunities, engage ecosystem and drive program development from idea to proof of concept for transfer to high volume manufacturing.

The ideal candidate will combine deep knowledge of 300mm Advanced Packaging technologies with a broad ecosystem network, including equipment suppliers and IDM/Foundry/Memory customers.