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Intel Corporation in Phoenix, AZ is seeking a Packaging Module Development Engineer to advance assembly processes and equipment, enabling Intel's roadmap for future packaging platforms.
The role focuses on optimizing manufacturability, developing DOE-driven analyses, and establishing material specifications while collaborating with supplier quality teams to ensure reliability, quality and cost targets. This is an on-site position based in Phoenix, Arizona.
Intel Corporation in Phoenix, AZ is seeking a Packaging Module Development Engineer to advance assembly processes and equipment, enabling Intel's roadmap for future packaging platforms.
The role focuses on optimizing manufacturability, developing DOE-driven analyses, and establishing material specifications while collaborating with supplier quality teams to ensure reliability, quality and cost targets. This is an on-site position based in Phoenix, Arizona.