Packaging Equipment & Process Innovation Engineer

Intel

Phoenix (AZ)

On-site

USD 115,000 - 220,000

Full time

15 hours ago
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Job summary

Intel is seeking an experienced engineer to develop assembly processes and equipment for the company’s packaging roadmap. You will optimize manufacturing efficiency to meet quality, reliability, cost, yield and productivity targets.

The role requires strong experience with semiconductor processes, DOE and SPC, plus project leadership to drive time-critical technical projects. The position is on-site in the Phoenix area and carries a competitive compensation package.

Qualifications

  • Bachelor's degree with 6+ years of industry experience OR Master's with 3+ years OR PhD with 6+ months experience.
  • Experience with semiconductor equipment integration and packaging processes.
  • Familiarity with DOE and SPC principles and industrial data analysis.

Responsibilities

  • Develops assembly processes and equipment to enable Intel's packaging roadmap.
  • Optimizes manufacturing efficiency to meet quality, yield, cost and productivity targets.
  • Documents improvements with white papers and applies DOE for experiments.
  • Leads reliability and process improvement initiatives using statistics.

Skills

Semiconductor experience
DOE (Design of Experiments)
SPC (Statistical Process Control)
Project management
Problem solving

Education

Bachelor's degree in Engineering/Physics/Chemistry or related STEM
Master's degree in Engineering/Physics/Chemistry or related STEM
PhD in Engineering/Physics/Chemistry or related STEM

Job description

Intel is seeking an experienced engineer to develop assembly processes and equipment for the company’s packaging roadmap. You will optimize manufacturing efficiency to meet quality, reliability, cost, yield and productivity targets.

The role requires strong experience with semiconductor processes, DOE and SPC, plus project leadership to drive time-critical technical projects. The position is on-site in the Phoenix area and carries a competitive compensation package.

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