Lead Advanced Packaging Integration Technologist

EMD Electronics; Tempe (AZ); On-site; USD 178,600 - 287,900; Full time

Benefits offered by this job

Health insurance

Paid time off (PTO)

Retirement contributions

Job summary

EMD Electronics in Tempe, Arizona is seeking a talented professional to develop strategies for High Performance Packaging. You will connect with key business units, driving product development from concept to high volume manufacturing.

The ideal candidate has an MSc or higher in Engineering and over 10 years of R&D experience with Advanced Packaging tools. The position includes a competitive salary and various benefits, including health insurance and paid time off.

Qualifications

• 10+ years of hands-on experience with Advanced Packaging equipment tools.
• 7+ years of collaborative external business development experience.
• Demonstrated ability to work across matrixed organizations.

Responsibilities

• Identify key High Performance Packaging technology inflection points.
• Collaborate with business units to identify material solutions.
• Engage the ecosystem on collaborative development opportunities.

Skills

High Performance Packaging technology expertise

R&D experience in 300mm process and equipment

External business development skills

Ability to influence and work in ambiguous environments

Education

MSc or higher in Mechanical Engineering, Electrical Engineering, Chemical Engineering

Job description

EMD Electronics in Tempe, Arizona is seeking a talented professional to develop strategies for High Performance Packaging. You will connect with key business units, driving product development from concept to high volume manufacturing.

The ideal candidate has an MSc or higher in Engineering and over 10 years of R&D experience with Advanced Packaging tools. The position includes a competitive salary and various benefits, including health insurance and paid time off.