Advanced Packaging Principal Integration Technologist

EMD Electronics; Tempe (AZ); On-site; USD 178,600 - 287,900; Full time

Benefits offered by this job

Health insurance

Paid time off (PTO)

Retirement contributions

Job summary

EMD Electronics in Tempe, Arizona is seeking a talented professional to develop strategies for High Performance Packaging. You will connect with key business units, driving product development from concept to high volume manufacturing.

The ideal candidate has an MSc or higher in Engineering and over 10 years of R&D experience with Advanced Packaging tools. The position includes a competitive salary and various benefits, including health insurance and paid time off.

Qualifications

• 10+ years of hands-on experience with Advanced Packaging equipment tools.
• 7+ years of collaborative external business development experience.
• Demonstrated ability to work across matrixed organizations.

Responsibilities

• Identify key High Performance Packaging technology inflection points.
• Collaborate with business units to identify material solutions.
• Engage the ecosystem on collaborative development opportunities.

Skills

High Performance Packaging technology expertise

R&D experience in 300mm process and equipment

External business development skills

Ability to influence and work in ambiguous environments

Education

MSc or higher in Mechanical Engineering, Electrical Engineering, Chemical Engineering

Job description

Your Role

In this role you will be instrumental in developing our High Performance Packaging (Advanced Packaging) opportunity definition, ecosystem engagement strategy, and program development. By connecting across key business unit partners and leveraging EMD Electronics core competencies, you will drive business and product development from idea to proof of concept for transfer to high volume manufacturing.

Responsibilities

• Identify and stay ahead of key High Performance Packaging technology inflection points and roadmaps through technical expertise.
• Continue to acquire in-depth strategic knowledge of customer and OEM roadmaps via industry/ecosystem connections.
• Transfer knowledge and educate peers (both laterally and upward) on High Performance Packaging roadmaps.
• Leverage industry knowledge to identify process, equipment and integration challenges.
• Collaborate with BU’s and CTO office to identify material solutions and developments that solve industry challenges.
• Engage the ecosystem on collaborative development opportunities using your industry network and connections.
• Ensure development programs identify and meet industry‑standard datasets using deep technical knowledge.
• Deliver relevant datasets in the timeliest manner.

Minimum Qualifications

• MSc or higher (Mechanical Engineering, Electrical Engineering, Chemical Engineering or related fields).
• 10+ years of 300mm process and equipment R&D hands‑on experience, including ownership of Advanced Packaging (300mm) equipment tools, development of Advanced Packaging thin‑film deposition/CMP/bonding or patterning processes, and integration and process flow development.
• 7+ years of collaborative external business development experience, including SOW, POC and DOE on equipment/material definition.

Preferred Qualifications

• 5+ years of Advanced Packaging consortia engagements (e.g., IMEC, Fraunhofer, CEA Leti) including engagement model definition, SOW development and POC execution.
• Demonstrated ability to work in highly ambiguous environments.
• Demonstrated ability to work across matrixed organizations and deliver results.
• Demonstrated ability to influence and garner resources.
• Entrepreneurial mindset.
• Ability to condense complex material into actionable items.
• Ability to enroll resources to deliver success.
• Demonstrated knowledge of customer and supplier interactions and how to extract key insights.
• Self‑starter, able to operate with little direction.

Employment Eligibility

This role does not offer sponsorship for work authorization. External applicants must be eligible to work in the US.

Pay & Benefits

Pay range: $178,600 - $287,900. Position may be eligible for sales or performance‑based bonuses. Benefits include health insurance, paid time off (PTO), retirement contributions and other perquisites.