Advanced Packaging Process Integration & Yield Engineer

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 89,000 - 171,000; Full time

Benefits offered by this job

Competitive pay with stock bonuses

Comprehensive health, retirement and 0

Vacation benefits

Job summary

Intel Corporation in the United States (Arizona, Phoenix) seeks a Process Integration and Yield Engineer to drive technology transfer and optimize manufacturing processes. You will define process integration roadmaps and workflows, leveraging data-driven insights to enhance product quality and yield, while collaborating across a networked organization.

The role is part of the Assembly Package Test Manufacturing (APTM) group, focused on developing packaging strategies.

Qualifications

• Bachelor’s degree with 3+ years of experience in semiconductor, manufacturing or advanced packaging.
• Master’s degree with 2+ years of experience in engineering.
• PhD in Engineering with 1+ year of experience acceptable in related fields.

Responsibilities

• Manage development and baseline data collection activities for TV and Products.
• Key contact for process level issues within package assembly.
• Manage DOE plans and data collection supporting technology development, die-package interactions, yield improvement, and design rule validation.
• Manage substrates and materials to meet forecasted costs and schedule.
• Engage with stakeholders to deliver holistic solutions to problems.
• Develop solutions using statistical knowledge and problem-solving tools.
• Achieve timely results by working across organizational boundaries with an innovative culture.

Skills

Exceptional communication skills

Collaboration

Proactive problem-solving

Attention to detail

Education

Bachelor’s degree in Engineering

Master’s degree in Engineering

PhD in Engineering

Tools

CSAM

Xray

XPS

FTIR

SEM

EDX

Job description

Intel Corporation in the United States (Arizona, Phoenix) seeks a Process Integration and Yield Engineer to drive technology transfer and optimize manufacturing processes. You will define process integration roadmaps and workflows, leveraging data-driven insights to enhance product quality and yield, while collaborating across a networked organization.

The role is part of the Assembly Package Test Manufacturing (APTM) group, focused on developing packaging strategies.