Advanced Packaging Process Integration Engineer

Intel Corporation; Chandler (AZ); On-site; USD 89,000 - 171,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Paid time off

Job summary

Intel Corporation in Arizona is seeking a Process Integration and Yield Engineer to drive technology transfer and optimize manufacturing processes. You will define roadmaps, establish workflows, and use data-driven insights to improve product quality, yield, and operations.

The role sits in the Assembly Package Test Manufacturing (APTM) group, focusing on advanced packaging programs and cross-functional collaboration across die-package interfaces, process flow, and cost-effective solutions to

Qualifications

• Bachelor's degree in Engineering or related field with relevant experience.
• Experience in semiconductor manufacturing or related industry preferred.
• Strong collaboration and problem-solving skills required.

Responsibilities

• Lead development and data collection for TV and product lines.
• Serve as key contact for process-level issues in package assembly.
• Plan and manage DOE studies to support technology development and yield improvements.
• Coordinate substrates and materials to meet cost and schedule targets.
• Collaborate with stakeholders to deliver holistic, data-driven solutions.

Skills

Communication skills

Collaboration

Problem solving

Attention to detail

Education

Bachelor's degree in Engineering

Tools

CSAM

X-ray

XPS

FTIR

SEM

EDX

Job description

Intel Corporation in Arizona is seeking a Process Integration and Yield Engineer to drive technology transfer and optimize manufacturing processes. You will define roadmaps, establish workflows, and use data-driven insights to improve product quality, yield, and operations.

The role sits in the Assembly Package Test Manufacturing (APTM) group, focusing on advanced packaging programs and cross-functional collaboration across die-package interfaces, process flow, and cost-effective solutions to