Advanced Packaging Principal Integration Technologist

Merck KGa A,Darmstadt,Germany; United States; On-site; USD 136,000 - 204,000; Full time

Benefits offered by this job

Health insurance

PTO

Retirement contributions

Job summary

EMD Electronics in the United States is seeking a leader to develop High Performance Packaging opportunities, engage ecosystem and drive program development from idea to proof of concept for transfer to high volume manufacturing.

The ideal candidate will combine deep knowledge of 300mm Advanced Packaging technologies with a broad ecosystem network, including equipment suppliers and IDM/Foundry/Memory customers.

Qualifications

• MSc or higher in Mechanical Eng, Electrical Eng, Chem Eng or related engineering fields.
• 8 Years 300mm Process/ Equipment R&D hands on experience.
• Advanced Packaging (300mm) Equipment Tool owner.
• Advanced Packaging Thin Films Dep/CMP/Bonding or Patterning Process development.
• Experience developing integration and process flows.
• Experience collaborating with external business developments.
• SOW (Scope of Work)/ POC (Proof of Concept)/DOE’s on equip/material definition.

Responsibilities

• Through technical expertise identify and stay ahead of key High Performance Packaging (Advanced Packaging) technology inflection points and roadmaps.
• Transfer knowledge/educate peers on High Performance Packaging roadmaps.
• Leverage industry knowledge to identify process/equipment/integration challenges.
• Work across BU’s and CTO office to identify material solutions/developments to solve industry challenges.
• Leverage industry network and connections to engage the ecosystem on collaborative development opportunities.

Skills

Advanced Packaging

Education

MSc or higher in Mechanical/Electrical/Chemical Eng or related engineering fields

Tools

Advanced Packaging Equipment Tool owner

Job description

Work Your Magic with us! Start your next chapter and join EMD Electronics.

Ready to explore, break barriers, and discover more? We know you’ve got big plans — so do we! Our colleagues across the globe love innovating with science and technology to enrich people’s lives with our solutions in Healthcare, Life Science, and Electronics. Together, we dream big and are passionate about caring for our rich mix of people, customers, patients, and planet. That’s why we are always looking for curious minds that see themselves imagining the unimaginable with us.

Everything we do in EMD Electronics is to help us deliver on our purpose of being the company behind the companies, advancing digital living. We are dedicated to being the trusted supplier of high-tech materials, services and specialty chemicals for the electronics, automotive and cosmetics industries. We foster a global collaborative organization made up of individuals who have the passion to win, obsess about the customer, are relentlessly curious and act with urgency. Together, we push the boundaries of science to make more possible for our customers.

Your Role:

In this role you will be instrumental in developing our High Performance Packaging (Advanced Packaging) opportunity definition, ecosystem engagement strategy and program development. By connecting across key business unit partners and leveraging EMD Electronics core competencies, the candidate will drive business and product development from idea to proof of concept for transfer to high volume manufacturing.

The ideal candidate will combine a deep equipment, process and integration knowledge of High Performance Packaging technologies (including Wafer Level Packaging, Hybrid Bonding, Fusion bonding and adjacent technologies) with a vast ecosystem network (both equipment suppliers and IDM/Foundry/Memory customers).

Responsibilities:

• Through technical expertise identify and stay ahead of key High Performance Packaging (Advanced Packaging) technology inflection points and roadmaps
• Transfer knowledge/educate peers (both laterally and up) on High Performance Packaging (Advanced Packaging) roadmaps
• Leverage industry knowledge to identify process/equipment/integration challenges
• Work across BU’s and CTO office to identify material solutions/developments to solve industry challenges
• Leverage industry network and connections to engage the ecosystem on collaborative development opportunities

Who You Are

Minimum Qualifications:

• MSc or higher (Mechanical Eng, Electrical Eng, Chem Eng or related engineering fields)
• 8 Years 300mm Process/ Equipment R&D hands on experience
• Advanced Packaging (300mm) Equipment Tool owner
• Advanced Packaging Thin Films Dep/CMP/Bonding or Patterning Process development
• Experience developing integration and process flows
• Experience collaborating with external business developments
• SOW (Scope of Work)/ POC (Proof of Concept)/DOE’s on equip/material definition

Preferred Qualifications:

• 5 years’ experience of Advanced Packaging Consortia engagements (IMEC, Fraunhofer, CEA Leti, etc) including engagement model definition/ SOW development/ POC execution.
• Demonstrated ability to work in highly ambiguous environments
• Demonstrated ability to work across matrixed organizations and deliver results
• Demonstrated ability to influence up to garner resources
• Entrepreneurial mindset
• Ability to condense complicated material down to key actionable items
• Ability to enroll resources to deliver successDemonstrated knowledge of customer/supplier interactions and how best to ‘mine’ the ‘why’s & how’s’ from those conversations
• Self-starter, ability to operate with little direction

Pay Range for this position: $136,000 – $204,000

The offer range represents the anticipated low and high end of the base pay compensation for this position. The actual compensation offered will be determined by factors such as location, level of experience, education, skills, and other job-related factors. Position may be eligible for sales or performance-based bonuses.

Benefits offered by the Company include health insurance, paid time off (PTO), retirement contributions, and other perquisites.

What we offer:

We are curious minds that come from a broad range of backgrounds, perspectives, and life experiences. We believe that this variety drives excellence and innovation, strengthening our ability to lead in science and technology. We are committed to creating access and opportunities for all to develop and grow at your own pace. Join us in building a culture of inclusion and belonging that impacts millions and empowers everyone to work their magic and champion human progress!