Senior Advanced Packaging Designer for Chiplet Solutions

Chipletz, Inc.; Austin (TX); On-site; USD 120,000 - 180,000; Full time

Job summary

Chipletz, Inc. is seeking an experienced packaging engineer to lead the design and verification of advanced package tech. You will define test strategies for new technologies, work with ecosystem partners, and guide design rules for substrate and board levels.

Ideal candidates bring hands-on experience with test chips, strong communication, and the ability to travel domestically as needed to support global partnerships and manufacturing partners.

Qualifications

• Proven track record in developing board or package design rules with ecosystem partners.
• Hands-on test chip experience and understanding of substrate design.
• Excellent verbal and written communication skills with partners, colleagues, and architects.
• Willingness to travel domestically.

Responsibilities

• Design and develop advanced packaging technologies for Chipletz products.
• Define and implement DFM/DFY guidelines for manufacturability and yield.
• Drive cost and SI/PI assessment based on design decisions.
• Collaborate with OSATs and substrate vendors to advance packaging concepts.

Skills

Board/package design rules

Communication

Leadership

Education

B.S. in Engineering

Master of Engineering

Tools

Mentor Graphics XPD

Mentor Graphics Xpedition

Cadence APD

AutoCAD

Python

Job description

Chipletz, Inc. is seeking an experienced packaging engineer to lead the design and verification of advanced package tech. You will define test strategies for new technologies, work with ecosystem partners, and guide design rules for substrate and board levels.

Ideal candidates bring hands-on experience with test chips, strong communication, and the ability to travel domestically as needed to support global partnerships and manufacturing partners.