Senior Advanced Packaging Architect

Synopsys Inc; San Diego (CA); On-site; USD 150,000 - 230,000; Full time

Job summary

Synopsys Inc in San Diego seeks a seasoned hardware packaging engineer to lead advanced silicon package design and analysis. You will drive SIPI requirements, model complex interposers and RDL fanout packages, and mentor teams across product groups.

You will collaborate with cross-functional teams, apply multi-physics analysis, and contribute to industry-leading packaging solutions for high-performance silicon.

Qualifications

• Bachelor's degree in Electrical or Electronic Engineering; advanced degree preferred.
• 10+ years in advanced package design, model extraction, and analysis.
• Deep knowledge of advanced circuit and transmission line theory.
• Hands-on experience with leading package technologies (TSMC/Intel/Samsung/OSAT).
• Proficiency in multi-physics analysis and operating systems (Windows/Linux).

Responsibilities

• Collaborate with cross-functional teams to define SIPI requirements and optimize performance.
• Design and develop advanced silicon package solutions (interposers, RDL fanout, silicon bridges).
• Model, simulate, and analyze package designs for electrical, thermal, and mechanical performance.
• Represent Synopsys as a technical leader on packaging projects and mentor teammates.
• Resolve design and integration issues using data-driven approaches and customer engagements.

Skills

Advanced packaging

Multi-physics analysis

Electrical/Transmission line theory

Cross-functional collaboration

Communication

Education

Bachelor's degree in Electrical or Electronic Engineering

Master’s or PhD preferred

Tools

Cadence APD

Innovus

Integrity-3DIC

Synopsys ICC2

3DIC Compiler

Fusion Compiler

Job description

Synopsys Inc in San Diego seeks a seasoned hardware packaging engineer to lead advanced silicon package design and analysis. You will drive SIPI requirements, model complex interposers and RDL fanout packages, and mentor teams across product groups.

You will collaborate with cross-functional teams, apply multi-physics analysis, and contribute to industry-leading packaging solutions for high-performance silicon.