Senior Packaging Solutions Architect (3D-IC & Chiplet)

Cadence Design Systems; USA; Hybrid; USD 162.000 - 302.000; Vollzeit

Benefits dieser Stelle

Medical, dental and vision plans

401(k) plan with employer match

Bonus and equity opportunities

Flexible work options (Remote orHybrid

Zusammenfassung

Cadence Design Systems seeks a Solutions Architect Engineer to support customers developing next-generation advanced packaging solutions, including 2.5D, 3D-IC, and chiplet-based architectures. You will work with leading semiconductor companies, OSATs, foundries, and system companies to deploy and optimize Cadence Advanced Package design flows.

The role combines technical leadership, customer engagement, solution development, and collaboration with R&D to drive customer success and product

Qualifikationen

• Bachelor’s degree in Electrical or Electronics Engineering or related discipline; 10+ years in packaging.
• Strong knowledge of advanced package design methodologies, 2.5D/3D-IC integration, chiplet architectures.
• Experience with package layout, routing, and signoff; understanding of stackups and substrates.

Aufgaben

• Provide technical leadership and application support for Cadence 3D-IC design solutions.
• Assist customers with advanced package architecture, design implementation and methodology development.
• Develop and demonstrate complete packaging workflows for 2.5D and 3D-IC integration and chiplet-based architectures.
• Support customer evaluations, proofs-of-concept, benchmarks, and production deployments.
• Deliver technical presentations, product demonstrations, workshops, and training sessions.
• Collaborate with sales to identify opportunities and provide pre-sales support.
• Work with R&D to communicate customer requirements and enhancement requests.
• Support DRC/LVS, connectivity verification, thermal analysis, SI/PI.
• Develop best practices, reference flows, and customer success methodologies.
• Assist in defining future product direction for advanced packaging and chiplet technologies.

Kenntnisse

Semiconductor packaging

3D-IC integration

Chiplet architectures

High-speed signals

Power integrity

Customer communication

Ausbildung

Electrical Engineering degree

Masters preferred

Tools

Cadence Integrity 3D

Cadence Sigrity

Cadence Clarity 3D Solver

Cadence Allegro X APD

Jobbeschreibung

Cadence Design Systems seeks a Solutions Architect Engineer to support customers developing next-generation advanced packaging solutions, including 2.5D, 3D-IC, and chiplet-based architectures. You will work with leading semiconductor companies, OSATs, foundries, and system companies to deploy and optimize Cadence Advanced Package design flows.

The role combines technical leadership, customer engagement, solution development, and collaboration with R&D to drive customer success and product