Senior Director, Advanced IC Packaging

AMD; San Jose (CA); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Industry-leading benefits

Global team

Executive visibility

Job summary

AMD in San Jose seeks a Senior Director of Packaging Engineering to lead strategy, development, and execution of advanced IC packaging across the product portfolio. You will build a global engineering team and guide packaging from concept to manufacturing ramps.

The role requires setting direction for multi-die/chiplet architectures, partnering with OSAT and suppliers, delivering cost-efficient, reliable solutions while driving cross-functional collaboration with product design, marketing, and

Qualifications

• Senior packaging engineering leadership experience in semiconductors.
• Experience leading global engineering teams and managing budgets/headcount.
• Deep technical expertise in advanced packaging technologies and SI/PI methods.

Responsibilities

• Own end-to-end packaging development from concept through NPI and high-volume manufacturing.
• Lead global team of engineers and develop organizational depth through talent development.
• Direct package-level signal integrity and power integrity co-design strategy and modeling.
• Partner with OSAT, substrate, and PWB suppliers for tech qualification and ramp.
• Translate product requirements into scalable packaging solutions across portfolios.
• Establish budgets, headcount plans, and schedules for the packaging organization.

Skills

Leadership

Semiconductor packaging

System-level design

Cross-functional

Mentorship & talent dev

Executive communication

Education

Bachelor's degree in Electrical Engineering or related

Job description

AMD in San Jose seeks a Senior Director of Packaging Engineering to lead strategy, development, and execution of advanced IC packaging across the product portfolio. You will build a global engineering team and guide packaging from concept to manufacturing ramps.

The role requires setting direction for multi-die/chiplet architectures, partnering with OSAT and suppliers, delivering cost-efficient, reliable solutions while driving cross-functional collaboration with product design, marketing, and