Package Designer

Chipletz, Inc.; Austin (TX); Vor Ort; USD 120.000 - 180.000; Vollzeit

Zusammenfassung

Chipletz, Inc. is seeking an experienced packaging engineer to lead the design and verification of advanced package tech. You will define test strategies for new technologies, work with ecosystem partners, and guide design rules for substrate and board levels.

Ideal candidates bring hands-on experience with test chips, strong communication, and the ability to travel domestically as needed to support global partnerships and manufacturing partners.

Qualifikationen

• Proven track record in developing board or package design rules with ecosystem partners.
• Hands-on test chip experience and understanding of substrate design.
• Excellent verbal and written communication skills with partners, colleagues, and architects.
• Willingness to travel domestically.

Aufgaben

• Design and develop advanced packaging technologies for Chipletz products.
• Define and implement DFM/DFY guidelines for manufacturability and yield.
• Drive cost and SI/PI assessment based on design decisions.
• Collaborate with OSATs and substrate vendors to advance packaging concepts.

Kenntnisse

Board/package design rules

Communication

Leadership

Ausbildung

B.S. in Engineering

Master of Engineering

Tools

Mentor Graphics XPD

Mentor Graphics Xpedition

Cadence APD

AutoCAD

Python

Jobbeschreibung

• Responsible for new product package design, verification, and validation.
• Member of an advanced packaging team, focused on developing new technologies for heterogeneous packages.
• Defines test chip/test vehicle strategy to qualify new technology building blocks.
• Partners with internal and external organizations to optimize design and analyze performance vs yield trade-off.
• Drive technology design rules with ecosystem partners and support package design, SI/PI studies on new packaging concepts to drive advanced packaging technologies to support new Chipletz products.

The Person

The candidate should have a proven track record in developing board or package design rules with ecosystem partners as well as hands‑on experience in test chip and general understanding of substrate design. He/she should be able to leverage a deep expertise in board design or already possess a deep understanding of substrate design to complete the package design tasks. The candidate should have excellent verbal and written communication skills to articulate ideas to technology partners, colleagues, and product architects. Expect some domestic travel.

Key Responsibilities

• Design and develop advanced packaging technologies for Chipletz products
• Define and implement design for manufacturing/design for yield (DFM/DFY) guidelines
• Ability to drive cost and SI/PI assessment based on design
• Experience with Mentor Graphics-XPD, Mentor Graphics Xpedition, Cadence APD, AutoCAD
• 5yrs experience with B.S. in Engineering or 4yrs experience with Master of engineering
• Experience with scripting tools such as VBS, SKILL, Python, etc.

Preferred Experience

• Defining and implementing advanced design rules as well as DFM/DFY rules
• Demonstrated leadership mentoring others
• Working directly with OSATs and substrate vendors