Senior 3D Heterogeneous Integration Engineer

Global Foundries; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries in the United States (Essex Junction, VT) seeks an experienced R&D engineer for the Advanced Packaging Lab to lead 3D-Heterogeneous Integration initiatives across multiple applications. You will drive BEOL/3D-HI process development, partner with unit process, manufacturing, and vendors, and steer joint development projects for 2.5D/3D integration while enabling rapid prototyping.

Strong problem-solving, DOE expertise, and English fluency are required; travel up to 10% may be

Qualifications

• Master's in a relevant engineering field with 4–5 years of related work experience and GPA ≥ 3.0.
• Strong BEOL process knowledge (advanced bonding, TSVs) and wafer/package integration.
• Fluent English communication; travel up to 10%.

Responsibilities

• Drive 3D-HI process development for multi-die stacking, bonding, and related packaging solutions.
• Collaborate with unit process, manufacturing, and vendor teams for GlobalFoundries fabs.
• Lead joint development projects (JDP) to advance 2.5D/3D HI processes and integration.
• Drive end-to-end process integration and prototyping across programs.
• Generate IP related to wafer integration and packaging technology.

Skills

Design of Experiments

Troubleshooting

Strong problem solving

Education

Master's degree in Electrical/Mechanical/Chemical Engineering or Materials Science

Job description

GlobalFoundries in the United States (Essex Junction, VT) seeks an experienced R&D engineer for the Advanced Packaging Lab to lead 3D-Heterogeneous Integration initiatives across multiple applications. You will drive BEOL/3D-HI process development, partner with unit process, manufacturing, and vendors, and steer joint development projects for 2.5D/3D integration while enabling rapid prototyping.

Strong problem-solving, DOE expertise, and English fluency are required; travel up to 10% may be