Lead 3D Heterogeneous Integration Engineer

GLOBALFOUNDRIES U.S. INC.; Town of Malta (NY); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries Fab8 is seeking an experienced R&D engineer to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives in the Advanced Packaging Lab (APL). You will drive BEOL/3D integration programs across multiple domains, collaborate with process engineers and vendors, and develop new wafer-level and 2.5D/3D HI processes for next-generation packaging solutions.

Ideal candidates hold a Master’s degree with 5+ years of related experience, strong design of experiments capabilities, and

Qualifications

• Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• MS degree with at least 5 years of prior related work experience.
• In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
• Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 10%.

Responsibilities

• Drive 3D-HI process development efforts for building blocks required for advanced packaging solutions across GF product lines.
• Partner with unit process engineers, manufacturing engineers, and vendors for GlobalFoundries fabs.
• Collaborate joint development projects to develop new wafer level and die level 2.5D and 3D HI processes.
• Drive end-to-end process integration and planning for new capabilities and early prototyping.
• Develop expertise in processes, materials, and tooling; optimize characterization resources.
• Drive data analysis, interpretation of results, and understanding of failure modes.
• Identify and resolve process integration issues and related challenges.
• Generate IP related to novel wafer integration and packaging technology.

Skills

Problem solving

Data analysis

Design of experiments

Written & Verbal English

English fluency

Education

Master’s in Electrical/Mechanical/Chemical/Materials Science or related

MS with 5+ years experience

PhD preferred

Tools

Wafer bonding

TSV integration

Package development & assembly

Metrology & characterization tools

Job description

GlobalFoundries Fab8 is seeking an experienced R&D engineer to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives in the Advanced Packaging Lab (APL). You will drive BEOL/3D integration programs across multiple domains, collaborate with process engineers and vendors, and develop new wafer-level and 2.5D/3D HI processes for next-generation packaging solutions.

Ideal candidates hold a Master’s degree with 5+ years of related experience, strong design of experiments capabilities, and